56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
LOQUET, Yannick, MIGNOT, Yann, MORRIS, Bryan, KLEEMEIER, Walter, LINIGER, E, SPOONER, Terry, WASKIEWICZ, Christopher, CHEN, James Hsueh-Chung, SANKARAPANDIAN, Muthumanickam, CHEN, Shyng-Tsong, FLAITZ, Philip, TOMIZAWA, Hideyuki, TSENG, Chia-Hsun, BEARD, Marcy
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Conference Proceeding
Journal Article
A Study of Metal on Metal Multiple Patterning Scheme
Chen, James Hsueh-Chung, Silvestre, Mary-Claire, Ghosh, Somnath, Mignot, Yann, Kelly, James J., Clevenger, Lawrence A., Spooner, Terry A.
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
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Conference Proceeding
Interconnect performance and scaling strategy at 7 nm node
Chen, James Hsueh-Chung, Standaert, Theodorus E., Alptekin, Emre, Spooner, Terry A., Paruchuri, Vamsi
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Published in IEEE International Interconnect Technology Conference (01.05.2014)
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Conference Proceeding
Middle of line RC performance study at the 7 nm node
Fan, Susan Su-Chen, Chen, James Hsueh-Chung, Kamineni, Vimal Kumar, Xunyuan Zhang, Raymond, Mark, Labelle, Cathy
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
Interconnect performance and scaling strategy at the 5 nm Node
Chen, James Hsueh-Chung, LiCausi, Nicholas, Ryan, E. Todd, Standaert, Theodorus E., Bonilla, Griselda
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
Strategy of Insertion of Merge Features in a Sea of Wires SADP Integration
Chen, James Hsueh-Chung, Spooner, Terry A., Clevenger, Lawrence A., O'Toole, Martin, Ogino, Atsushi, Lanzerotti, Louis, Reidy, Sean, Child, Craig
Published in 2018 IEEE International Interconnect Technology Conference (IITC) (01.06.2018)
Published in 2018 IEEE International Interconnect Technology Conference (IITC) (01.06.2018)
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Conference Proceeding
Segment removal strategy in SAQP for advanced BEOL application
Chen, James Hsueh-Chung, Spooner, Terry A., Stephens, Jason E., O'Toole, Martin, LiCausi, Nicholas, Ben Kim, Narasimha, Shreesh, Child, Craig
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
A Study on SADP Process Refresh for Patterning Correction
Chen, James Hsueh-Chung, Estrada-Raygoza, Isabel C, Peethale, Cornelius Brown, Mignot, Yann, Shobha, Hosadurga, Standaert, Theodorus E
Published in 2018 IEEE International Interconnect Technology Conference (IITC) (01.06.2018)
Published in 2018 IEEE International Interconnect Technology Conference (IITC) (01.06.2018)
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Conference Proceeding
Planarity considerations in SADP for advanced BEOL patterning
Chen, James Hsueh-Chung, Spooner, Terry A., Stephens, Jason E., Law, Shao Beng, Beique, Genevieve, Kim, Ben, O'Toole, Martin, Lanzerotti, Louis, Leibiger, Steven, Ryan, E. Todd, Narasimha, Shreesh, Child, Craig
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
Post porosity plasma protection integration at 48 nm pitch
Huai Huang, Lionti, Krystelle, Volksen, Willi, Spooner, Terry, Shobha, Hosadurga, Joe Lee, Chen, James Hsueh-Chung, Magbitang, Teddie, Peethala, Brown, Liniger, Eric G., Chao Kun Hu, Huang, Elbert, Canaperi, Donald F., Standaert, Theodorus E., Edelstein, Daniel C., Grill, Alfred, Dubois, Geraud, Bonilla, Griselda
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
Chen, J. H.-C, Waskiewicz, C., Fan, S. S.-C, Halle, S., Chiew-seng Koay, Yongan Xu, Saulnier, N., Chia-Hsun Tseng, Yunpeng Yin, Mignot, Y., Beard, M., Morris, B., Horak, D., Mignot, S., Shobha, H., Sankarapandian, M., van der Straten, O., Kelly, J. J., Canaperi, D., Mclellan, E., Boye, C., Levin, T., Juntao Li, Demarest, J., Choi, S., Huang, E., Liemann, L., Haran, B., Arnold, J. C., Colburn, M., Clevenger, L., Spooner, T.
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding
56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
Loquet, Yannick, Mignot, Yann, Waskiewicz, Christopher, Chen, James Hsueh-Chung, Sankarapandian, Muthumanickam, Chen, Shyng-Tsong, Flaitz, Philip, Tomizawa, Hideyuki, Tseng, Chia-Hsun, Beard, Marcy, Morris, Bryan, Kleemeier, Walter, Liniger, E., Spooner, Terry
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article