by Shih, Meng-Kai, Lai, Weihong, Liao, Tsewei, Chen, Karen, Chen, Dao-Long, Hung, C. P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2022)

by Chen, Bo-Heng, Hwang, Sheng-Jye, Chang, Yu-Yang, Yang, Yu-Shuo, Lee, Huei-Huang, Huang, Bing-Yuan, Hu, Ian, Chen, Dao-Long, Tarng, David, Hung, C. P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2022)

by Wen, Hao-xiang, Lai, Xiao-han, Chen, Long-dao, Cai, Zhong-fa
Published in Journal of Central South University (2015)

by Shih, Meng-Kai, Shih, Sean, Liao, Tse-Wei, Chen, Dao-Long, Liu, D.S., Tarng, David
Published in Microelectronics and reliability (01.03.2022)

by Chang-Chi Lee, Hung, C. P., Calvin Cheung, Ping-Feng Yang, Chin-Li Kao, Dao-Long Chen, Meng-Kai Shih, Chien-Lin Chang Chien, Yu-Hsiang Hsiao, Li-Chieh Chen, Su, Michael, Alfano, Michael, Siegel, Joe, Din, Julius, Black, Bryan
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

by Chen, Dao-Long, Yang, Ping-Feng, Lai, Yi-Shao
Published in Microelectronics and reliability (01.03.2012)

by Chen, Dao-Long, Wong, Ee-Hua, Chen, Tei-Chen
Published in International journal of solids and structures (01.10.2016)

by Chen, Dao-Long, Chen, Tang-Yuan, Lai, Wei-Hong, Yin, Wei-Jie, Kuo, Chun-Liang, Ko, Chun-Yu, Cheng, Chi-Min
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)

by LUO, Yu, LI, Sheng-xiang, CHEN, Dao-long, LIU, Xi-ling, MA, Chun-de, LI, Xi-bing
Published in Transactions of Nonferrous Metals Society of China (01.12.2021)

by Hung, Hao-Hsi, Cheng, Yu-Chi, Hwang, Sheng-Jye, Chang, Hui-Jing, Huang, Bing-Yuan, Huang, Hung-Hsien, Chen, Dao-Long, Wang, Chen-Chao, Hung, Chih-Pin
Published in Results in engineering (01.09.2024)

by Tasi, Cheng-Hsun, Tseng, Yu-Chin, Jian, Sheng-Rui, Liao, Ying-Yen, Lin, Chih-Ming, Yang, Ping-Feng, Chen, Dao-Long, Chen, Hsueh-Ju, Luo, Chih-Wei, Juang, Jenh-Yih
Published in Journal of alloys and compounds (15.01.2015)

by Wang, Chien-Yu, Chiu, Tz-Cheng, Yin, Wei-Jie, Chen, Dao-Long, Chen, Tang-Yuan, Kao, Chin-Li
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

by Chen, Dao-Long, Chang, Hui-Jing, Chen, Tang-Yuan, Hu, Yung-Hsiang, Chen, Ting-Bin, Pan, Chi-Hung, Yang, Yu-Shuo, Hwang, Sheng-Jye
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)

by Chen, Dao-Long, Chen, Tei-Chen, Yang, Ping-Feng, Lai, Yi-Shao
Published in Microelectronics and reliability (01.04.2015)

by Chen, Chia-Yu, Lee, Yu-Ching, Chen, Kuo-Shen, Chen, Dao-Long, Lin, Yu-Xuan, Lai, Wei-Hong, Yang, Hung-Chun, Chen, Tang-Yuan, Ho, Ching-Jenq, Kao, Chin-Li
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)

by Wong, E.H., Cook, J., Dreno, M., Chen, Dao-Long, Lai, Yi-Shao
Published in Microelectronics and reliability (01.11.2015)

by Chen, Dao-Long, Chen, Tei-Chen
Published in Nanotechnology (01.12.2005)

by Chen, Dao-Long
Published in IEEE journal of solid-state circuits (01.08.1996)

by Chen, Dao-Long, Chiu, Tz-Cheng, Chen, Tei-Chen, Chung, Ming-Hua, Yang, Ping-Feng, Lai, Yi-Shao
Published in Procedia engineering (2014)

by Yang, Ping-Feng, Chen, Dao-Long, Jian, Sheng-Rui, Lee, Sheng-Wei, Tseng, Chung-Jen
Published in Procedia engineering (2014)