A wafer-scale 3-D circuit integration technology
Burns, J.A., Aull, B.F., Chen, C.K., Chang-Lee Chen, Keast, C.L., Knecht, J.M., Suntharalingam, V., Warner, K., Wyatt, P.W., Yost, D.-R.W.
Published in IEEE transactions on electron devices (01.10.2006)
Published in IEEE transactions on electron devices (01.10.2006)
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Journal Article
Radiation Effects in 3D Integrated SOI SRAM Circuits
Gouker, P. M., Tyrrell, B., D'Onofrio, R., Wyatt, P., Soares, T., Weilin Hu, Chenson Chen, Schwank, J. R., Shaneyfelt, M. R., Blackmore, E. W., Delikat, K., Nelson, M., McMarr, P., Hughes, H., Ahlbin, J. R., Weeden-Wright, S., Schrimpf, R.
Published in IEEE transactions on nuclear science (01.12.2011)
Published in IEEE transactions on nuclear science (01.12.2011)
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Journal Article
SET Characterization in Logic Circuits Fabricated in a 3DIC Technology
Gouker, P. M., Tyrrell, B., Renzi, M., Chenson Chen, Wyatt, P., Ahlbin, J. R., Weeden-Wright, S., Atkinson, N. M., Gaspard, N. J., Bhuva, B. L., Massengill, L. W., Enxia Zhang, Schrimpf, R., Weller, R. A., King, M. P., Gadlage, M. J.
Published in IEEE transactions on nuclear science (01.12.2011)
Published in IEEE transactions on nuclear science (01.12.2011)
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Journal Article
SOI for MEMS and advanced packaging
Muldavin, J., Bozler, C., Yost, D., Chen, C., Wyatt, P.
Published in 2012 IEEE International SOI Conference (SOI) (01.10.2012)
Published in 2012 IEEE International SOI Conference (SOI) (01.10.2012)
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Conference Proceeding
SOI circuits powered by embedded solar cell
Chang-Lee Chen, Chen, C. K., Vitale, S. A.
Published in IEEE 2011 International SOI Conference (01.10.2011)
Published in IEEE 2011 International SOI Conference (01.10.2011)
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Conference Proceeding
Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology
Suntharalingam, V., Berger, R., Burns, J.A., Chen, C.K., Keast, C.L., Knecht, J.M., Lambert, R.D., Newcomb, K.L., O'Mara, D.M., Rathman, D.D., Shaver, D.C., Soares, A.M., Stevenson, C.N., Tyrrell, B.M., Warner, K., Wheeler, B.D., Yost, D.-R.W., Young, D.J.
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)
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Conference Proceeding
Interconnect structures for assembly of multi-layer semiconductor devices
Das Rabindra N, Keast Craig L, Warner Keith, Vitale Steven A, Chen Chenson, Gouker Mark A, Yost Donna-Ruth W
Year of Publication 03.10.2017
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Year of Publication 03.10.2017
Patent
Interconnect Structures for Assembly of Multi-Layer Semiconductor Devices
Das Rabindra N, Keast Craig L, Warner Keith, Vitale Steven A, Chen Chenson, Gouker Mark A, Yost Donna-Ruth W
Year of Publication 13.07.2017
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Year of Publication 13.07.2017
Patent
INTERCONNECT STRUCTURES FOR ASSEMBLY OF MULTI-LAYER SEMICONDUCTOR DEVICES
DAS, RABINDRA, N, CHEN, CHENSON, VITALE, STEVEN, A, WARNER, KEITH, KEAST, CRAIG, L, YOST, DONNA-RUTH, W, GOUKER, MARK, A
Year of Publication 18.02.2016
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Year of Publication 18.02.2016
Patent
Enhanced resolution for future fabrication
Fritze, M., Keast, C.L., Chen, C.K., Astolfi, D.K., Yost, D.R., Burns, J.A., Chang-Lee Chen, Gouker, P.M., Suntharalingam, V., Wyatt, P.W.
Published in IEEE circuits and devices magazine (01.01.2003)
Published in IEEE circuits and devices magazine (01.01.2003)
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Journal Article