Identification of peptides from brain and pituitary of Cpe(fat)/Cpe(fat) mice
Che, F Y, Yan, L, Li, H, Mzhavia, N, Devi, L A, Fricker, L D
Published in Proceedings of the National Academy of Sciences - PNAS (14.08.2001)
Published in Proceedings of the National Academy of Sciences - PNAS (14.08.2001)
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Journal Article
Peptidomics of Cpe super(fat-fat) mouse brain regions: implications for neuropeptide processing
Zhang, Xin, Che, Fa-Yun, Berezniuk, Iryna, Sonmez, Kemal, Toll, Lawrence, Fricker, Lloyd D
Published in Journal of neurochemistry (01.12.2008)
Published in Journal of neurochemistry (01.12.2008)
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Journal Article
Peptidomics of Cpe fat/fat mouse brain regions: implications for neuropeptide processing
Zhang, Xin, Che, Fa‐Yun, Berezniuk, Iryna, Sonmez, Kemal, Toll, Lawrence, Fricker, Lloyd D.
Published in Journal of neurochemistry (01.12.2008)
Published in Journal of neurochemistry (01.12.2008)
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Journal Article
The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐ x Al lead‐free solder alloys ( x =0, 1, 1.5 and 2 wt.%)
Abdul‐Ameer Shnawah, Dhafer, Faizul Mohd Sabri, Mohd, Anjum Badruddin, Irfan, Xing Che, Fa
Published in Microelectronics international (04.05.2012)
Published in Microelectronics international (04.05.2012)
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Journal Article
Peptidomics of Cpe Mouse Hypothalamus
Che, Fa-Yun, Yuan, Quan, Kalinina, Elena, Fricker, Lloyd D.
Published in The Journal of biological chemistry (01.02.2005)
Published in The Journal of biological chemistry (01.02.2005)
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Journal Article
Partial Underfill Impact Study on Solder Joint Reliability in Smartphone Application
Pan, Ling, Che, Fa Xing, Ong, Yeow Chon, Ng, Hong Wan, Sinha, Koustav, Chen, Wren
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
PCB Design Parameters of Reducing Copper Trace Crack under Temperature Cycle Test
Chen, Wren, Yang, Pluck, Sinha, Koustav, Glancey, Christopher, Pan, Ling, Che, Fa Xing, Ong, Yeow Chon
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Study on Solder Joint Shape Impact on Board Level Reliability for Managed NAND Mobile Package
Che, Fa Xing, Ong, Yeow Chon, Pan, Ling, Yu, Wei, Wan Ng, Hong
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Bonding integrity enhancement in wafer to wafer fine pitch hybrid bonding by advanced numerical modelling
Ji, Lin, Che, Fa Xing, Ji, Hong Miao, Li, Hong Yu, Kawano, Masaya
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction
Che, Fa Xing, Ong, Yeow Chon, Ng, Hong Wan, Pan, Ling, Glancey, Christopher, Sinha, Koustav, Fan, Richard
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Altered neuropeptide processing in prefrontal cortex of Cpe super(fat-fat) mice: implications for neuropeptide discovery
Lim, Jihyeon, Berezniuk, Iryna, Che, Fa-Yun, Parikh, Rishi, Biswas, Reeta, Pan, Hui, Fricker, Lloyd D
Published in Journal of neurochemistry (01.02.2006)
Published in Journal of neurochemistry (01.02.2006)
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Journal Article
Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder
Fa-Xing Che, Jing-En Luan, Yap, Daniel, Kim-Yong Goh, Baraton, Xavier
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding
Effect of Printed Circuit Board Design Parameters on Solder Joint Reliability for Memory Packages
Sinha, Koustav, Glancey, Christopher, Chen, Wren, Yang, Pluck, Pan, Ling, Che, Fa Xing, Ong, Yeow Chon, Ng, Hong Wan
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Failure Mechanism and Prevention of Die Cracking for FBGA Package Misplaced in the Tray
Che, Fa Xing, Ong, Yeow Chon, Zhang, Yu Ling, Lau, See Ting
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding