Search Results - "CHAWLA Jasmeet S" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Determining the shape and periodicity of nanostructures using small-angle X-ray scattering

Determining the shape and periodicity of nanostructures using small-angle X-ray scattering

by Sunday, Daniel F., List, Scott, Chawla, Jasmeet S., Kline, R. Joseph
Published in Journal of applied crystallography (01.10.2015)

Get full text

Journal Article

마이크로 전자 도전성 경로들 및 이를 제조하는 방법

마이크로 전자 도전성 경로들 및 이를 제조하는 방법

by HOURANI RAMI, KOBRINSKY MAURO J, ROBERTS JEANETTE M, CLENDENNING SCOTT B, CHAWLA JASMEET S, GSTREIN FLORIAN
Year of Publication 08.01.2018

Get full text

Patent

METHOD AND STRUCTURE TO CONTACT TIGHT PITCH CONDUCTIVE LAYERS WITH GUIDED VIAS USING ALTERNATING HARDMASKS AND ENCAPSULATING ETCHSTOP LINER SCHEME

METHOD AND STRUCTURE TO CONTACT TIGHT PITCH CONDUCTIVE LAYERS WITH GUIDED VIAS USING ALTERNATING HARDMASKS AND ENCAPSULATING ETCHSTOP LINER SCHEME

by SCHENKER RICHARD E, BRAIN RUTH A, MYERS ALAN M, SINGH KANWAL JIT, CHAWLA JASMEET S
Year of Publication 23.08.2017

Get full text

Patent

DIAGONAL HARDMASKS FOR IMPROVED OVERLAY IN FABRICATING BACK END OF LINE (BEOL) INTERCONNECTS

DIAGONAL HARDMASKS FOR IMPROVED OVERLAY IN FABRICATING BACK END OF LINE (BEOL) INTERCONNECTS

by MYERS ALAN M, SINGH KANWAL JIT, CHAWLA JASMEET S, BRISTOL ROBERT L
Year of Publication 18.08.2016

Get full text

Patent

METHODS FOR FORMING INTERCONNECT LAYERS HAVING TIGHT PITCH INTERCONNECT STRUCTURES

METHODS FOR FORMING INTERCONNECT LAYERS HAVING TIGHT PITCH INTERCONNECT STRUCTURES

by SCHENKER RICHARD E, TAN ELIOT N, MYERS ALAN M, SINGH KANWAL JIT, CHAWLA JASMEET S, JEZEWSKI CHRISTOPHER J
Year of Publication 23.09.2016

Get full text

Patent

NOVEL METHOD FOR CREATING ALTERNATE HARDMASK CAP INTERCONNECT STRUCTURE WITH INCREASED OVERLAY MARGIN

NOVEL METHOD FOR CREATING ALTERNATE HARDMASK CAP INTERCONNECT STRUCTURE WITH INCREASED OVERLAY MARGIN

by CHANDHOK MANISH, HOURANI RAMI, SCHENKER RICHARD E, CHAWLA JASMEET S, YOUNKIN TODD R, HAN EUNGNAK, LIN KEVIN, GSTREIN FLORIAN, BRISTOL ROBERT L
Year of Publication 01.09.2017

Get full text

Patent

Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films

Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films

by Lin, Kevin L., Bielefeld, Jeffrey, Chawla, Jasmeet S., Carver, Colin T., Chebiam, Ramanan, Clarke, James S., Faber, Jacob, Harmes, Michael, Indukuri, Tejaswi, Jezewski, Christopher, Kasim, Rahim, Kobrinsky, Mauro, Kabir, Nafees A., Krist, Brian, Lakamraju, Narendra, Lang, Hazel, Mays, Ebony, Myers, Alan M., Plombon, John J., Singh, Kanwal Jit, Torres, Jessica, Yoo, Hui Jae
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)

Get full text

Conference Proceeding

Structural characterization of a Cu/MgO(001) interface using CS-corrected HRTEM

Structural characterization of a Cu/MgO(001) interface using CS-corrected HRTEM

by CAZOTTES, S, ZHANG, Z. L, DANIEL, R, CHAWLA, J. S, GALL, D, DEHM, G
Published in Thin solid films (01.12.2010)

Get full text

Conference Proceeding Journal Article

METHOD OF FORMING HIGH DENSITY, HIGH SHORTING MARGIN, AND LOW CAPACITANCE INTERCONNECTS BY ALTERNATING RECESSED TRENCHES

METHOD OF FORMING HIGH DENSITY, HIGH SHORTING MARGIN, AND LOW CAPACITANCE INTERCONNECTS BY ALTERNATING RECESSED TRENCHES

by JEZEWSKI, Christopher J, CHAWLA, Jasmeet S
Year of Publication 25.08.2022

Get full text

Patent

Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches

Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches

by Chawla, Jasmeet S, Jezewski, Christopher J
Year of Publication 05.07.2022

Get full text

Patent

ENCAPSULATION OF AIR GAPS IN INTERCONNECTS

ENCAPSULATION OF AIR GAPS IN INTERCONNECTS

by CHANDHOK, Manish, NASKAR, Sudipto, CHAWLA, Jasmeet S
Year of Publication 05.07.2018

Get full text

Patent

METHOD OF FORMING HIGH DENSITY, HIGH SHORTING MARGIN, AND LOW CAPACITANCE INTERCONNECTS BY ALTERNATING RECESSED TRENCHES

METHOD OF FORMING HIGH DENSITY, HIGH SHORTING MARGIN, AND LOW CAPACITANCE INTERCONNECTS BY ALTERNATING RECESSED TRENCHES

by JEZEWSKI, Christopher J, CHAWLA, Jasmeet S
Year of Publication 28.06.2018

Get full text

Patent

METHOD OF MAKING INSULATING SIDEWALL LINERS IN TRENCHES

METHOD OF MAKING INSULATING SIDEWALL LINERS IN TRENCHES

by CLENDENNING, Scott B, GSTREIN, Florian, KOBRINSKY, Mauro J, CHAWLA, Jasmeet S, ROBERTS, Jeanette M, HOURANI, Rami
Year of Publication 27.10.2021

Get full text

Patent

Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches

Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches

by Jezewski Christopher J, Chawla Jasmeet S
Year of Publication 06.03.2018

Get full text

Patent

METHODS OF FABRICATING CONDUCTIVE CONNECTORS HAVING A RUTHENIUM/ALUMINUM-CONTAINING LINER

METHODS OF FABRICATING CONDUCTIVE CONNECTORS HAVING A RUTHENIUM/ALUMINUM-CONTAINING LINER

by CLARKE, James S, JEZEWSKI, Christopher J, KOBRINSKY, Mauro J, CHEBIAM, Ramanan V, CHAWLA, Jasmeet S
Year of Publication 23.12.2020

Get full text

Patent

Techniques for forming vias and other interconnects for integrated circuit structures

Techniques for forming vias and other interconnects for integrated circuit structures

by Nikonov, Dmitri E, Lin, Chia-Ching, Manipatruni, Sasikanth, Bristol, Robert L, Young, Ian A, Chawla, Jasmeet S
Year of Publication 20.07.2021

Get full text

Patent

TECHNIQUES FOR FORMING VIAS AND OTHER INTERCONNECTS FOR INTEGRATED CIRCUIT STRUCTURES

TECHNIQUES FOR FORMING VIAS AND OTHER INTERCONNECTS FOR INTEGRATED CIRCUIT STRUCTURES

by BRISTOL, Robert L, MANIPATRUNI, Sasikanth, NIKONOV, Dmitri E, LIN, Chia-Ching, CHAWLA, Jasmeet S, YOUNG, Ian A
Year of Publication 07.07.2021

Get full text

Patent

METHOD OF FORMING HIGH DENSITY, HIGH SHORTING MARGIN, AND LOW CAPACITANCE INTERCONNECTS BY ALTERNATING RECESSED TRENCHES

METHOD OF FORMING HIGH DENSITY, HIGH SHORTING MARGIN, AND LOW CAPACITANCE INTERCONNECTS BY ALTERNATING RECESSED TRENCHES

by JEZEWSKI Christopher J, CHAWLA Jasmeet S
Year of Publication 27.10.2016

Get full text

Patent

Compliant layer for wafer to wafer bonding

Compliant layer for wafer to wafer bonding

by McDonnell, Myra, Kobrinsky, Mauro J, Chawla, Jasmeet S, Meister, Stefan, Pawashe, Chytra, Pantuso, Daniel
Year of Publication 07.07.2020

Get full text

Patent

Maskless air gap to prevent via punch through

Maskless air gap to prevent via punch through

by Younkin, Todd R, Han, Eungnak, Chandhok, Manish, Krysak, Marie, Tronic, Tristan A, Chawla, Jasmeet S, Yoo, Hui Jae
Year of Publication 06.04.2021

Get full text

Patent

1
2
3
4
5
6
7
Next
[7]