Scalable Multichip Packaging With Integrated Antenna Array for a 73-GHz Transceiver IC
Lambert, William J., Amadjikpe, Arnaud L., Yao, Jimin, Chavali, Sri Chaitra J., Sagazio, Peter, Nam, Ye Seul, Abu-Mahaimed, Marwan, Pellerano, Stefano
Published in IEEE transactions on microwave theory and techniques (01.01.2021)
Published in IEEE transactions on microwave theory and techniques (01.01.2021)
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Journal Article
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
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Year of Publication 25.01.2024
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Year of Publication 25.01.2024
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PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
ALUR, Siddharth K, VADLAMANI, Sai, DHALL, Ashish, CHAVALI, Sri Chaitra J, LEE, Kyu Oh, JAIN, Rahul, JEN, Wei-Lun K, MEHTA, Vipul V, MANEPALLI, Rahul N, ALUR, Amruthavalli P
Year of Publication 06.06.2024
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Year of Publication 06.06.2024
Patent
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
SANKMAN, Robert L, SWAMINATHAN, Rajasekaran, KARHADE, Omkar, MALLIK, Debendra, GANESAN, Sanka, LIFF, Shawna M, CHAVALI, Sri Chaitra J, ALUR, Amruthavalli, MODI, Mitul, NICKERSON, Robert
Year of Publication 04.05.2023
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Year of Publication 04.05.2023
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Antenna package using ball attach array to connect antenna and base substrates
Yao, Jimin, Zhang, Zhichao, Chavali, Sri Chaitra J, Liff, Shawna M, Lambert, William J, Sankman, Robert L
Year of Publication 07.06.2022
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Year of Publication 07.06.2022
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Package with underfill containment barrier
Mehta, Vipul V, Dhall, Ashish, Lee, Kyu Oh, Jain, Rahul, Jen, Wei-Lun K, Chavali, Sri Chaitra J, Alur, Siddharth K, Vadlamani, Sai, Alur, Amruthavalli P, Manepalli, Rahul N
Year of Publication 19.03.2024
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Year of Publication 19.03.2024
Patent
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
SANKMAN, Robert L, SWAMINATHAN, Rajasekaran, KARHADE, Omkar, MALLIK, Debendra, GANESAN, Sanka, LIFF, Shawna M, CHAVALI, Sri Chaitra J, ALUR, Amruthavalli, MODI, Mitul, NICKERSON, Robert
Year of Publication 27.10.2022
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Year of Publication 27.10.2022
Patent
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
ALUR, Siddharth K, VADLAMANI, Sai, DHALL, Ashish, CHAVALI, Sri Chaitra J, LEE, Kyu Oh, JAIN, Rahul, JEN, Wei-Lun K, MEHTA, Vipul V, MANEPALLI, Rahul N, ALUR, Amruthavalli P
Year of Publication 03.08.2023
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Year of Publication 03.08.2023
Patent
Ultra-thin, hyper-density semiconductor packages
Swaminathan, Rajasekaran, Karhade, Omkar, Modi, Mitul, Chavali, Sri Chaitra J, Ganesan, Sanka, Liff, Shawna M, Sankman, Robert L, Mallik, Debendra, Alur, Amruthavalli, Nickerson, Robert
Year of Publication 30.08.2022
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Year of Publication 30.08.2022
Patent
Package with underfill containment barrier
Mehta, Vipul V, Dhall, Ashish, Lee, Kyu Oh, Jain, Rahul, Jen, Wei-Lun K, Chavali, Sri Chaitra J, Alur, Siddharth K, Vadlamani, Sai, Alur, Amruthavalli P, Manepalli, Rahul N
Year of Publication 30.05.2023
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Year of Publication 30.05.2023
Patent
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE SUBSTRATES
LAMBERT, William J, SANKMAN, Robert L, ZHANG, Zhichao, LIFF, Shawna M, CHAVALI, Sri Chaitra J, YAO, Jimin
Year of Publication 24.09.2020
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Year of Publication 24.09.2020
Patent
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
Mehta, Vipul V, Dhall, Ashish, Lee, Kyu Oh, Jain, Rahul, Jen, Wei-Lun K, Chavali, Sri Chaitra J, Alur, Siddharth K, Vadlamani, Sai, Alur, Amruthavalli P, Manepalli, Rahul N
Year of Publication 16.12.2021
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Year of Publication 16.12.2021
Patent