Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias
Dixit, Pradeep, Yaofeng, Sun, Miao, Jianmin, Pang, John H. L., Chatterjee, Ritwik, Tummala, Rao R.
Published in Journal of the Electrochemical Society (2008)
Published in Journal of the Electrochemical Society (2008)
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Journal Article
The use of unsaturated fluorocarbons for dielectric etch applications
CHATTERJEE, Ritwik, KARECKI, Simon, REIF, Rafael, VARTANIAN, Victor, SPARKS, Terry
Published in Journal of the Electrochemical Society (01.04.2002)
Published in Journal of the Electrochemical Society (01.04.2002)
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Journal Article
Through-Silicon Via Fill for 3D Interconnect Applications
Mathew, Varughese, Chatterjee, Ritwik, Jones, Robert, Garcia, Sam, Acosta, Eddie, Huang, Zhihong
Published in ECS transactions (20.03.2009)
Published in ECS transactions (20.03.2009)
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Journal Article
Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits
Savidis, Ioannis, Alam, Syed M., Jain, Ankur, Pozder, Scott, Jones, Robert E., Chatterjee, Ritwik
Published in Microelectronics (01.01.2010)
Published in Microelectronics (01.01.2010)
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Journal Article
Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool
Karecki, Simon, Chatterjee, Ritwik, Pruette, Laura, Reif, Rafael, Sparks, Terry, Beu, Laurie, Vartanian, Victor, Novoselov, Konstantin
Published in Journal of the Electrochemical Society (2001)
Published in Journal of the Electrochemical Society (2001)
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Journal Article
Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects
Bandyopadhyay, T, Ki Jin Han, Daehyun Chung, Chatterjee, R, Swaminathan, M, Tummala, R
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2011)
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Journal Article
Evaluation of Pentafluoroethane and 1,1-Difluoroethane for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool
Karecki, Simon, Chatterjee, Ritwik, Pruette, Laura, Reif, Rafael, Sparks, Terry, Beu, Laurie, Vartanian, Victor
Published in Japanese Journal of Applied Physics (2000)
Published in Japanese Journal of Applied Physics (2000)
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Journal Article
Mask Defect Printability and Wafer Process Critical Dimension Control at 0.25 µm Design Rules
Yan, Pei-yang, Langston, Joe, Neff, Julie, Chatterjee, Ritwik
Published in Japanese Journal of Applied Physics (01.12.1995)
Published in Japanese Journal of Applied Physics (01.12.1995)
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Journal Article
Mask defect printability and wafer process critical dimension control at 0.25 μm design rules
PEI-YANG YAN, LANGSTON, J, NEFF, J, CHATTERJEE, R
Published in Japanese journal of applied physics (01.12.1995)
Published in Japanese journal of applied physics (01.12.1995)
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Conference Proceeding
Trend from ICs to 3D ICs to 3D systems
Tummala, R.R., Sundaram, V., Chatterjee, R., Raj, P.M., Kumbhat, N., Sukumaran, V., Sridharan, V., Choudury, A., Qiao Chen, Bandyopadhyay, T.
Published in 2009 IEEE Custom Integrated Circuits Conference (01.09.2009)
Published in 2009 IEEE Custom Integrated Circuits Conference (01.09.2009)
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Conference Proceeding
Reliability Considerations in 3D Stacked Strata Systems
Pozder, Scott, Jain, Ankur, Jones, Robert, Huang, Zhihong, Justison, Patrick, Chatterjee, Ritwik
Published in AIP conference proceedings (07.11.2008)
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Published in AIP conference proceedings (07.11.2008)
Journal Article
Technology and Application of 3D Interconnect
Jones, R.E.
Published in 2007 IEEE International Conference on Integrated Circuit Design and Technology (01.05.2007)
Published in 2007 IEEE International Conference on Integrated Circuit Design and Technology (01.05.2007)
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Conference Proceeding
Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)
Xi Liu, Qiao Chen, Dixit, P., Chatterjee, R., Tummala, R.R., Sitaraman, S.K.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding