Manufacturability of chemical vapor deposition of copper
NGUYEN, T, CHARNESKI, L. J, SHENG TENG HSU
Published in Journal of the Electrochemical Society (01.08.1997)
Published in Journal of the Electrochemical Society (01.08.1997)
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Journal Article
Temperature dependence of the morphology of copper sputter deposited on TiN coated substrates
NGUYEN, T, CHARNESKI, L. J, EVANS, D. R
Published in Journal of the Electrochemical Society (01.10.1997)
Published in Journal of the Electrochemical Society (01.10.1997)
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Journal Article