An embedded trace FCCSP substrate without glass cloth
Chao, Shin-Hua, Hung, Chih-Ping, Chen, Mark, Lee, Youru, Huang, Joey, Kao, Golden, Luh, Ding-Bang
Published in Microelectronics and reliability (01.02.2016)
Published in Microelectronics and reliability (01.02.2016)
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Journal Article
Fine line/space IC substrate made by selectively fully additive process
Shin-Hua Chao, Chao-Fu Weng
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
A study of chip-last embedded flip-chip package
Chao, Shin-Hua, Tong, Ho-Ming, Hung, Chih-Pin, Lai, Yishao, Liu, Colin, Hsieh, Emma, Luh, Ding-Bang
Published in Journal of the Chinese Institute of Engineers (18.08.2014)
Published in Journal of the Chinese Institute of Engineers (18.08.2014)
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Journal Article
New wave Fan-out package : For heterogeneous integration
Shin-Hua Chao, Yuan-Fu Sung, Ding-Bang Luh
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
A study of chip-last embedded FCCSP
Shin-Hua Chao, Chih-Pin Hung, Yishao Lai, Liu, Colin, Hsieh, Emma, Ding-Bang Luh
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Adjuvant Effects of Fermented Red Ginseng Extract on Advanced Non-Small Cell Lung Cancer Patients Treated with Chemotherapy
Jiang, Shu-long, Liu, Hong-jie, Liu, Zhao-chun, Liu, Ning, Liu, Rui, Kang, Young-Reep, Ji, Joong-Gu, Zhang, Chao, Hua, Bao-jin, Kang, Shin-Jyung
Published in Chinese journal of integrative medicine (01.05.2017)
Published in Chinese journal of integrative medicine (01.05.2017)
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Journal Article