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MOLDED SIP PACKAGE WITH REINFORCED SOLDER COLUMNS
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Year of Publication 01.11.2007
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Molded SiP package with reinforced solder columns
CHIU CHIN-TIEN, TAKIAR HEM, JAVA ZHU JIANG HUA, YU CHEEMEN, CHANGIEN JACK, LIU HUI
Year of Publication 01.11.2007
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Year of Publication 01.11.2007
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