Search Results - "CHANG TAI MIN" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Laser Lift-Off Mechanisms of GaN Epi-Layer Grown on Pattern Sapphire Substrate

Laser Lift-Off Mechanisms of GaN Epi-Layer Grown on Pattern Sapphire Substrate

by Chang, Tai-Min, Fang, Hsin-Kai, Liao, Cheng, Hsu, Wen-Yang, Wu, YewChung Sermon
Published in ECS journal of solid state science and technology (01.01.2015)

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Journal Article

Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt%Ag-0.5 wt%Cu Solder

Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt%Ag-0.5 wt%Cu Solder

by Chang, Tai-Min, Chen, Fu-Hsin, Chen, Meng-Yen, Wu, YewChung Sermon
Published in ECS journal of solid state science and technology (01.01.2015)

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Journal Article

High Brightness III - V Light-Emitting Diodes on Diamond/Silicon Composite Substrate

High Brightness III - V Light-Emitting Diodes on Diamond/Silicon Composite Substrate

by Chang, Tai-Min, Hu, Jen-Li, Lin, Bo-Wen, Wu, YewChung Sermon
Published in ECS transactions (01.04.2013)

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Journal Article

PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT

PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT

by LU DE YUAN, KUO HUNG JUI, CHANG TAI MIN, TSAI HUI JUNG, LEE MING TAN
Year of Publication 28.07.2021

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Patent

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

by HUANG HUNG YI, TSAI MING HSING, CHANG CHIH WEI, HUANG LIN YU, CHANG CHIEN, LIN KAN JU, CHANG TAI MIN, CHOU CHIH SHIUN
Year of Publication 29.11.2022

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Patent

RDL 3 THREE-STEP ETCHING TO FORM RDL

RDL 3 THREE-STEP ETCHING TO FORM RDL

by YU CHEN HUA, LEI YI YANG, PENG JYUN SIANG, KUO HUNG JUI, TSAI HUI JUNG, CHANG TAI MIN, HSIEH YUN CHEN
Year of Publication 27.05.2019

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Patent

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR

by Tsai, Hui-Jung, Kuo, Hung-Jui, Chang, Tai-Min
Year of Publication 30.11.2023

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Patent

Method for removing resist layer, and method of manufacturing semiconductor

Method for removing resist layer, and method of manufacturing semiconductor

by Tsai, Hui-Jung, Kuo, Hung-Jui, Chang, Tai-Min
Year of Publication 17.10.2023

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Patent

PACKAGE STRUCTURE

PACKAGE STRUCTURE

by Tsai, Hui-Jung, Kuo, Hung-Jui, Wang, Chia-Wei, Chang, Tai-Min
Year of Publication 22.08.2024

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Patent

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR

by Tsai, Hui-Jung, Kuo, Hung-Jui, Chang, Tai-Min
Year of Publication 22.09.2022

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Patent

Package structure having at least one die with a plurality of taper-shaped die connectors

Package structure having at least one die with a plurality of taper-shaped die connectors

by Tsai, Hui-Jung, Kuo, Hung-Jui, Wang, Chia-Wei, Chang, Tai-Min
Year of Publication 21.05.2024

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Patent

Method for removing resist layer, and method of manufacturing semiconductor

Method for removing resist layer, and method of manufacturing semiconductor

by Tsai, Hui-Jung, Kuo, Hung-Jui, Chang, Tai-Min
Year of Publication 05.07.2022

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Patent

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR

by Tsai, Hui-Jung, Kuo, Hung-Jui, Chang, Tai-Min
Year of Publication 31.03.2022

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Patent

Packages with enlarged through-vias in encapsulant

Packages with enlarged through-vias in encapsulant

by Tsai, Hui-Jung, Kuo, Hung-Jui, Lee, Ming-Tan, Chang, Tai-Min, Lu, De-Yuan
Year of Publication 21.11.2023

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Patent

PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT

PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT

by Tsai, Hui-Jung, Kuo, Hung-Jui, Lee, Ming-Tan, Chang, Tai-Min, Lu, De-Yuan
Year of Publication 16.11.2023

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Patent

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

by Tsai, Hui-Jung, Kuo, Hung-Jui, Wang, Chia-Wei, Chang, Tai-Min
Year of Publication 23.02.2023

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Patent

INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF PACKAGE STRUCTURE

INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF PACKAGE STRUCTURE

by Tsai, Hui-Jung, Kuo, Hung-Jui, Wang, Chia-Wei, Chang, Tai-Min
Year of Publication 16.02.2023

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Patent

Integrated circuit, package structure, and manufacturing method of package structure

Integrated circuit, package structure, and manufacturing method of package structure

by Tsai, Hui-Jung, Kuo, Hung-Jui, Wang, Chia-Wei, Chang, Tai-Min
Year of Publication 29.11.2022

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Patent

Packages with enlarged through-vias in encapsulant

Packages with enlarged through-vias in encapsulant

by Tsai, Hui-Jung, Kuo, Hung-Jui, Lee, Ming-Tan, Chang, Tai-Min, Lu, De-Yuan
Year of Publication 29.11.2022

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Patent

Package structure having taper-shaped conductive pillar and method of forming thereof

Package structure having taper-shaped conductive pillar and method of forming thereof

by Tsai, Hui-Jung, Kuo, Hung-Jui, Wang, Chia-Wei, Chang, Tai-Min
Year of Publication 22.11.2022

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Patent