PACKAGED DIE STACKS WITH STACKED CAPACITORS AND METHODS OF ASSEMBLING SAME
CHEAH Bok Eng, OOI Ping Ping, KONG Jackson Chung Peng, LUM Wen Wei, CHANG Mooi Ling
Year of Publication 26.09.2023
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Year of Publication 26.09.2023
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Vertical embedded component in a printed circuit board blind hole
Chuah, Tin Poay, Chang, Mooi Ling, Teoh, Hoay Tien, Lim, Min Suet, Kuan, Chin Lee
Year of Publication 04.07.2023
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Year of Publication 04.07.2023
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CO-PLANAR INTERCONNECTION MECHANISMS FOR CIRCUIT BOARDS
Chang, Mooi Ling, Chuah, Tin Poay, Loo, Twan Sing, Lim, Min Suet, Goh, Eng Huat
Year of Publication 02.06.2022
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Year of Publication 02.06.2022
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INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES
Chang, Mooi Ling, Ranjan, Prabhat, Khoo, Poh Boon, Lim, Min Suet, Goh, Eng Huat, Lim, Chu Aun
Year of Publication 23.03.2023
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Year of Publication 23.03.2023
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Packaged die stacks with stacked capacitors and methods of assembling same
Chang, Mooi Ling, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lum, Wen Wei, Ooi, Ping Ping
Year of Publication 14.09.2021
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Year of Publication 14.09.2021
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Over-molded IC package with in-mold capacitor
Chang, Mooi Ling, Kong, Jackson Chung Peng, Cheah, Bok Eng, Lum, Wen Wei, Ooi, Ping Ping
Year of Publication 04.05.2021
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Year of Publication 04.05.2021
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PACKAGED DIE STACKS WITH STACKED CAPACITORS AND METHODS OF ASSEMBLING SAME
Chang, Mooi Ling, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lum, Wen Wei, Ooi, Ping Ping
Year of Publication 07.01.2021
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Year of Publication 07.01.2021
Patent
Packaged die stacks with stacked capacitors and methods of assembling same
Chang, Mooi Ling, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lum, Wen Wei, Ooi, Ping Ping
Year of Publication 17.03.2020
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Year of Publication 17.03.2020
Patent
Over-molded IC packages with embedded voltage reference plane and heater spreader
Chang, Mooi Ling, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lum, Wen Wei, Ooi, Ping Ping
Year of Publication 21.01.2020
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Year of Publication 21.01.2020
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VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE
LIM, Min Suet, TEOH, Hoay Tien, CHANG, Mooi Ling, CHUAH, Tin Poay, KUAN, Chin Lee
Year of Publication 04.07.2019
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Year of Publication 04.07.2019
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COMPACT SEMICONDUCTOR CHIP SYSTEM AND METHOD
LEE, CHAN KIM, Chang, Mooi Ling, YEE, CHEE CHUN, Tan, Siang Yeong, Hoe, Wee, Tan, Say Thong Tony
Year of Publication 02.04.2020
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Year of Publication 02.04.2020
Patent
PACKAGED DIE STACKS WITH STACKED CAPACITORS AND METHODS OF ASSEMBLING SAME
Chang, Mooi Ling, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lum, Wen Wei, Ooi, Ping Ping
Year of Publication 03.01.2019
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Year of Publication 03.01.2019
Patent
OVER-MOLDED IC PACKAGES WITH EMBEDDED VOLTAGE REFERENCE PLANE & HEATER SPREADER
LUM, Wen Wei, CHEAH, Bok Eng, CHANG, Mooi Ling, OOI, Ping Ping, KONG, Jackson Chung Peng
Year of Publication 20.12.2018
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Year of Publication 20.12.2018
Patent
OVER-MOLDED IC PACKAGE WITH IN-MOLD CAPACITOR
LUM, Wen Wei, CHEAH, Bok Eng, CHANG, Mooi Ling, OOI, Ping Ping, KONG, Jackson Chung Peng
Year of Publication 13.12.2018
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Year of Publication 13.12.2018
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MULTIPLE-COMPONENT SUBSTRATE FOR A MICROELECTRONIC DEVICE
Chang, Mooi Ling, Chuah, Tin Poay, Lim, Min Suet, Goh, Eng Huat, Tan, Say Thong Tony
Year of Publication 24.05.2018
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Year of Publication 24.05.2018
Patent
MULTIPLE-COMPONENT SUBSTRATE FOR A MICROELECTRONIC DEVICE
LIM, Min Suet, CHANG, Mooi Ling, TAN, Say Thong Tony, CHUAH, Tin Poay, GOH, Eng Huat
Year of Publication 24.05.2018
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Year of Publication 24.05.2018
Patent
VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE
LIM, Min Suet, TEOH, Hoay Tien, CHANG, Mooi Ling, CHUAH, Tin Poay, KUAN, Chin Lee
Year of Publication 05.04.2018
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Year of Publication 05.04.2018
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