An Efficient IAKF Approach for Indoor Positioning Drift Correction
Lin, Shang-Hsien, Chang Chien, Hung-Hsien, Wang, Wei-Wen, Lin, Kuang-Hao, Li, Guan-Jin
Published in Sensors (Basel, Switzerland) (29.07.2022)
Published in Sensors (Basel, Switzerland) (29.07.2022)
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Journal Article
Development of Non-TSV Interposer (NTI) for High Electrical Performance Package
Fang-Yu Liang, Hung-Hsien Chang, Wen-Tsung Tseng, Lai, J. Y., Cheng, Stephen, Ma, Mike, Ramalingam, Suresh, Xin Wu, Gandhi, Jaspreet
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
New Stacked Die Interconnect Technology for High-Performance and Low-Cost FPGA
Kwon, Woon-Seong, Ramalingam, Suresh, Wu, Xin, Madden, Liam, Huang, C. Y., Chang, Hung-Hsien, Chiu, Chi-Hsin, Chiu, Steve, Chen, Stephen
Published in Journal of microelectronics and electronic packaging (01.07.2015)
Published in Journal of microelectronics and electronic packaging (01.07.2015)
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Journal Article
Integrated process characterization and fabrication challenges for 2.5D IC packaging utilizing silicon interposer with backside via reveal process
Cheng-Hsiang Liu, Jyun-Ling Tsai, Hung-Hsien Chang, Chang-Lun Lu, Shih-Ching Chen
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Study of TSV thinning wafer strength enhancement for 3DIC package
Jyun-Ling Tsai, Chun-Chieh Chao, Hsiao-Chun Huang, Cheng-Hsiang Liu, Hung-Hsien Chang, Chang-Lun Lu, Shih-Ching Chen
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Substrate structure
Huang, Chen-Yu, Lai, Yi-Che, Tseng, Wen-Tsung, Liang, Fang-Yu, Chang, Hung-Hsien
Year of Publication 05.02.2019
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Year of Publication 05.02.2019
Patent
Substrate structure
Huang, Chen-Yu, Lai, Yi-Che, Tseng, Wen-Tsung, Liang, Fang-Yu, Chang, Hung-Hsien
Year of Publication 14.08.2018
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Year of Publication 14.08.2018
Patent
SUBSTRATE STRUCTURE
Lai Yi-Che, Chang Hung-Hsien, Huang Chen-Yu, Tseng Wen-Tsung, Liang Fang-Yu
Year of Publication 02.11.2017
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Year of Publication 02.11.2017
Patent
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
Lai Yi-Che, Chang Hung-Hsien, Tseng Wen-Tsung, Yeh Yu-Ling, Tsai Jyun-Ling
Year of Publication 26.10.2017
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Year of Publication 26.10.2017
Patent
SUBSTRATE STRUCTURE
Lai Yi-Che, Chang Hung-Hsien, Huang Chen-Yu, Tseng Wen-Tsung, Liang Fang-Yu
Year of Publication 10.08.2017
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Year of Publication 10.08.2017
Patent
Method for fabricating semiconductor device
CHANG HUNG-HSIEN, FANG WEI-HUA, CHEN CHUN-YEN, WANG CHINE-LI, YEN YUNGIN
Year of Publication 08.07.2014
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Year of Publication 08.07.2014
Patent