PACKAGE SUBSTRATE
KIM, YONG SUK, LEE, BYOUNG HWA, CHANG, BYEUNG GYU, KIM, DOO YOUNG, LEE, TAEK JUNG
Year of Publication 12.01.2016
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Year of Publication 12.01.2016
Patent
FORMATION OF LARGE SCALE VIA SLUG FOR HIGH POWER LED PACKAGE
Park, J K, Hong, K P, Park, S Y, Chang, B G, Jeong, S G, Shin, H D
Published in Journal of Ceramic Processing & Research (01.06.2008)
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Published in Journal of Ceramic Processing & Research (01.06.2008)
Journal Article