Tungsten Contact and Line Resistance Reduction with Advanced Pulsed Nucleation Layer and Low Resistivity Tungsten Treatment
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Published in Japanese Journal of Applied Physics (01.09.2010)
Published in Japanese Journal of Applied Physics (01.09.2010)
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Year of Publication 31.03.2023
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CHAMBER CONDITIONING FOR REMOTE PLASMA PROCESS
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Year of Publication 14.02.2023
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핵생성 억제에 의한 피처 충진
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Year of Publication 06.12.2022
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기판 프로세싱 시스템의 배기부의 펌프로부터 증착물들을 제거하기 위한 세정 시스템
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Year of Publication 28.01.2021
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Year of Publication 21.10.2022
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반도체 프로세싱 작업에서의 개선된 에지 균일성을 위한 에지 링
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Year of Publication 05.07.2024
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ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
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Year of Publication 20.05.2024
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반응 물질 가스 펄스 전달
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Year of Publication 08.11.2022
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ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
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Year of Publication 09.01.2023
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