Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
Zhu, Ze, Chan, Yan-Cheong, Chen, Zhong, Gan, Chee-Lip, Wu, Fengshun
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (06.06.2018)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (06.06.2018)
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Journal Article
Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints
Hu, Tianwei, Li, Yi, Chan, Yan-Cheong, Wu, Fengshun
Published in Microelectronics and reliability (01.07.2015)
Published in Microelectronics and reliability (01.07.2015)
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Journal Article
Experimental Study on the Washing Durability of Electro-Textile UHF RFID Tags
Yan Yan Fu, Yuk Lam Chan, Ming Hao Yang, Yan-Cheong Chan, Virkki, Johanna, Bjorninen, Toni, Sydanheimo, Lauri, Ukkonen, Leena
Published in IEEE antennas and wireless propagation letters (01.01.2015)
Published in IEEE antennas and wireless propagation letters (01.01.2015)
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Journal Article
Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods
Zhu, Ze, Sun, Huayu, Wu, Fengshun, Chan, Yan-cheong
Published in Journal of materials science. Materials in electronics (01.07.2016)
Published in Journal of materials science. Materials in electronics (01.07.2016)
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Journal Article
Implementation and wireless readout of passive UHF RFID strain sensor tags based on electro-textile antennas
Feiyuan Long, Xiao Dong Zhang, Bjorninen, Toni, Virkki, Johanna, Sydanheimo, Lauri, Yan-Cheong Chan, Ukkonen, Leena
Published in 2015 9th European Conference on Antennas and Propagation (EuCAP) (01.04.2015)
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Published in 2015 9th European Conference on Antennas and Propagation (EuCAP) (01.04.2015)
Conference Proceeding
Reliability of wearable electronics - Case of water proof tests on smartwatch
Yip, Yuk-ngang Zita, Ze Zhu, Yan-cheong Chan
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Review on test vehicles for electromigration (EM) study in solder interconnects
Ze Zhu, Yan-cheong Chan, Fengshun Wu, Chee Lip Gan, Zhong Chen
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives
Chunyan Yin, Hua Lu, Bailey, C., Yan-Cheong Chan
Published in IEEE transactions on electronics packaging manufacturing (01.10.2004)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2004)
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Journal Article
Conference Proceeding
Brush-painted silver UHF RFID tags on environmental-friendly and flexible substrates
Yanan Ren, Virkki, Johanna, Sydanheimo, Lauri, Ukkonen, Leena, Yan-Cheong Chan
Published in 2015 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting (01.07.2015)
Published in 2015 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting (01.07.2015)
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Conference Proceeding
Impact of antenna-fiber alignment and recurrent stretching on the performance of passive UHF RFID tags based on textile antennas
Xiao Dong Zhang, Ming Hao Yang, Virkki, Johanna, Bjorninen, Toni, Merilampi, Sari, Sydanheimo, Lauri, Yan-Cheong Chan, Ukkonen, Leena
Published in 2014 IEEE MTT-S International Microwave Workshop Series on RF and Wireless Technologies for Biomedical and Healthcare Applications (IMWS-Bio2014) (01.12.2014)
Published in 2014 IEEE MTT-S International Microwave Workshop Series on RF and Wireless Technologies for Biomedical and Healthcare Applications (IMWS-Bio2014) (01.12.2014)
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Conference Proceeding
Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint
Zhu, Ze, Chan, Yan-cheong, Wu, Fengshun
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Improved Time-of-Flight Technique for Measuring Carrier Mobility in Thin Films of Organic Electroluminescent Materials
Chen, Baijun, Lee, Chun-sing, Lee, Shuit-tong, Webb, Patrick, Chan, Yan-cheong, Gambling, William, Tian, He, Zhu, Weihong
Published in Japanese Journal of Applied Physics (01.03.2000)
Published in Japanese Journal of Applied Physics (01.03.2000)
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Journal Article