Search Results - "CHAN ARGUEDAS, Sergio" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Thermal Management and Integrated Heat Spreader Assembly Challenges of Products with Variable Die Heights

Thermal Management and Integrated Heat Spreader Assembly Challenges of Products with Variable Die Heights

by Chowdhury, Arifur, Valavala, Krishna Vasanth, Saha, Amitesh, Arguedas, Sergio A Chan, Howell, Shenavia S, Li, Peng
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)

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Conference Proceeding

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)

by CHAN ARGUEDAS, Sergio, MALLIK, Debendra, JHA, Chandra M, YAO, Jimin
Year of Publication 17.07.2024

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Patent

First-level integration of second-level thermal interface material for integrated circuit assemblies

First-level integration of second-level thermal interface material for integrated circuit assemblies

by Chan Arguedas, Sergio, Antoniswamy, Aravindha, Bozorg-Grayeli, Elah, Arrington, Kyle
Year of Publication 23.01.2024

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Patent

MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES

MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES

by Chowdhury, Arifur, Chan Arguedas, Sergio Antonio, Ren, Zheng
Year of Publication 04.01.2024

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Patent

Additively manufactured structures for heat dissipation from integrated circuit devices

Additively manufactured structures for heat dissipation from integrated circuit devices

by Eid, Feras, Brun, Xavier, Chan Arguedas, Sergio Antonio, Walczyk, Joe, Diglio, Paul
Year of Publication 03.09.2024

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Patent

Integrated circuit packages with thermal interface materials with different material compositions

Integrated circuit packages with thermal interface materials with different material compositions

by Saha, Amitesh, Chan Arguedas, Sergio Antonio, Tarango Valles, Emilio, Cartas, Marco Aurelio, Hackenberg, Ken
Year of Publication 13.08.2024

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Patent

INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIAL

INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIAL

by Chan Arguedas, Sergio Antonio, Dubey, Manish
Year of Publication 31.12.2020

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Patent

Integrated circuit package lids with polymer features

Integrated circuit package lids with polymer features

by Gaines, Taylor William, Atadana, Frederick W, Chan Arguedas, Sergio Antonio, Cheney, Robert F, Bozorg-Grayeli, Elah
Year of Publication 19.03.2024

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Patent

Lids for integrated circuit packages with solder thermal interface materials

Lids for integrated circuit packages with solder thermal interface materials

by Falola, Bamidele Daniel, Li, Peng, Saha, Amitesh, Chan Arguedas, Sergio Antonio, Das Mahapatra, Susmriti
Year of Publication 14.11.2023

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Patent

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)

by Yao, Jimin, Chan Arguedas, Sergio Antonio, Jha, Chandra Mohan, Mallik, Debendra
Year of Publication 26.10.2023

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Patent

Microelectronic assemblies including a thermal interface material

Microelectronic assemblies including a thermal interface material

by Li, Peng, Liu, Yongmei, Chan Arguedas, Sergio Antonio, Hackenberg, Ken, Goyal, Deepak
Year of Publication 17.10.2023

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Patent

Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense

Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense

by Eid, Feras, Beatty, John J, Chan Arguedas, Sergio, Swan, Johanna M
Year of Publication 03.10.2023

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Patent

INTEGRATED CIRCUIT HEAT SPREADER INCLUDING SEALANT INTERFACE MATERIAL

INTEGRATED CIRCUIT HEAT SPREADER INCLUDING SEALANT INTERFACE MATERIAL

by Falola, Bamidele Daniel, Eid, Feras, Chan Arguedas, Sergio Antonio
Year of Publication 23.12.2021

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Patent

Microelectronic package with solder array thermal interface material (SA-TIM)

Microelectronic package with solder array thermal interface material (SA-TIM)

by Yao, Jimin, Chan Arguedas, Sergio Antonio, Jha, Chandra Mohan, Mallik, Debendra
Year of Publication 22.08.2023

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Patent

Integrated circuit packages with asymmetric adhesion material regions

Integrated circuit packages with asymmetric adhesion material regions

by Li, Peng, Howell, Shenavia S, Visvanathan, Karthik, Chan Arguedas, Sergio Antonio
Year of Publication 20.06.2023

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Patent

FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT ASSEMBLIES

FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT ASSEMBLIES

by Chan Arguedas, Sergio, Antoniswamy, Aravindha, Bozorg-Grayeli, Elah, Arrington, Kyle
Year of Publication 22.07.2021

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Patent

Vented lids for integrated circuit packages

Vented lids for integrated circuit packages

by Wan, Zhimin, Li, Peng, Antoniswamy, Aravindha R, Chan Arguedas, Sergio Antonio, Zhao, Junnan, Jha, Chandra Mohan, Xu, Cheng, Wang, Ying
Year of Publication 06.02.2024

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Patent

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

by HAEHN, Nicholas S, HEATON, Thomas, CETEGEN, Edvin, CHAN ARGUEDAS, Sergio, JAIN, Rahul, MEHTA, Vipul, CHO, Steve S, SINGH, Antariksh Rao Pratap, VEHONSKY, Jacob, IBRAHIM, Tarek, NEAL, Nicholas
Year of Publication 01.08.2024

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Patent

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)

by CHAN ARGUEDAS, Sergio, MALLIK, Debendra, JHA, Chandra M, YAO, Jimin
Year of Publication 30.12.2020

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Patent

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES

by Shia, David, Canham, Rick, Chan Arguedas, Sergio Antonio, Klein, Steven, Gosselin, Timothy, Cook, JR., Johnny, Antoniswamy, Aravindha, Bozorg-Grayeli, Elah
Year of Publication 04.07.2024

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Patent