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SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING
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Year of Publication 24.01.2019
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HALBLEITERVORRICHTUNG MIT HETEROGENER LÖTSTELLE UND VERFAHREN ZU IHRER HERSTELLUNG
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Mold-Gehäusestruktur mit Klebstoff-Auslaufstopper zum Abdichten eines MEMS-Bauelements und Verfahren zum Verpacken eines MEMS-Bauelements
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