Preparation of titanium oxynitride thin films by reactive sputtering using air/Ar mixtures
Get full text
Journal Article
Conference Proceeding
Preparation of ZrNxOy films by magnetron sputtering using air as a reactive gas
Get full text
Conference Proceeding
Journal Article
Characterization of Cr-doped TiO2 thin films prepared by cathodic arc plasma deposition
CHAN, Mu-Hsuan, HO, Wei-Yu, WANG, Da-Yung, LU, Fu-Hsing
Published in Surface & coatings technology (15.12.2007)
Published in Surface & coatings technology (15.12.2007)
Get full text
Conference Proceeding
Journal Article
X-ray photoelectron spectroscopy analyses of titanium oxynitride films prepared by magnetron sputtering using air/Ar mixtures
Get full text
Journal Article
Conference Proceeding
Influences of oxygen impurity contained in nitrogen on the reaction of titanium with nitrogen
Lu, Fu-Hsing, Jiang, Bor-Feng, Lo, Jen-Li, Chan, Mu-Hsuan
Published in Journal of materials research (01.07.2009)
Published in Journal of materials research (01.07.2009)
Get full text
Journal Article
Characteristics of chromium-doped titanium oxide coatings synthesized by cathodic arc deposition
Ho, Wei-Yu, Chan, Mu-Hsuan, Yao, Kao-Shan, Chang, Chi-Lung, Wang, Da-Yung, Hsu, Cheng-Hsun
Published in Thin solid films (01.10.2008)
Published in Thin solid films (01.10.2008)
Get full text
Journal Article
Effects of cleaning process on the reliability of ultra-fine gap for 3D package
Mu-Hsuan Chan, Hsue, Brock, Chun-Tang Lin, Chiu, Steve, Yu-Po Wang
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Get full text
Conference Proceeding
Underfill adhesion enhancement via optimization of plasma treatment for 3DIC
Chi-Tung Yeh, Huei-Nuan Huang, Pai-Yuan Lee, Mu-Hsuan Chan, Lin, G. T., Chiu, Steve
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Get full text
Conference Proceeding
Heat-resistance study of thermal release tape
Chieh-Yuan Chi, Chun-Tang Lin, Jung-Pang Huang, Mu-Hsuan Chan, Yan-Yi Liao, Yan-Heng Chen, Wei-Yu Chen
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Get full text
Conference Proceeding
Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package
Mu-Hsuan Chan, Yi-Chian Liao, Chun-Tang Lin, Kuan-Weir Chuang, Huei-Nuan Huang, Chi-Tung Yeh, Wen-Tsung Tseng, Jeng-Yuan Lai
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Get full text
Conference Proceeding
Effective 3DIC chip module warpage with UF design by analytical method
Pai-Yuan Lee, Chi-Tung Yeh, Huei-Nuan Huang, Mu-Hsuan Chan, Chun-Tang Lin, Chiu, Steve, Ma, Mike
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Get full text
Conference Proceeding
High thermal conductivity underfill study for fine pitch Cu pillar bump
Huei-Nuan Huang, Mei-Chin Lee, Chi-Tung Yeh, Pai-Yuan Lee, Mu-Hsuan Chan, Chun-Tang Lin, Chiu, Steve, Ma, Mike
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Get full text
Conference Proceeding
3DIC Stacking Process Investigation by Soldering Bonding Technology
Li, Jay, Jhen Chen, Wei, Lin, Joe, Hsuan Chan, Mu, Lo, Tank, Xu, Bruce, Yih Hung, Liang, Kao, Nicholas, Son Jiang, Don, Wang, Yu-Po
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration
Lia, Jay, Tsai, Fang-Lin, Li, Jackson, Pan, George, Chan, Mu-Hsuan, Zheng, Louise, Chen, Steven, Kao, Nicholas, Lai, David, Wan, Katch, Wang, Yu-Po
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Get full text
Conference Proceeding
A study on the 3DIC interconnection using thermal compression bond with non conductive paste process
Mu-Hsuan Chan, Huei-Nuan Huang, Chien-Feng Chan, Chun-Tang Lin, Yang, M-H, Jeng Yuan Lai
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Get full text
Conference Proceeding