Prediction of Losses Caused by Roughness of Metallization in Printed-Circuit Boards
Deutsch, A., Surovic, C.W., Krabbenhoft, R.S., Kopcsay, G.V., Chamberlin, B.J.
Published in IEEE transactions on advanced packaging (01.05.2007)
Published in IEEE transactions on advanced packaging (01.05.2007)
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Journal Article
Extraction of εr(f) and tan δ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
DEUTSCH, Alina, WINKEL, Thomas-Michael, KOPCSAY, Gerard V, SUROVIC, Christopher W, RUBIN, Barry J, KATOPIS, George A, CHAMBERLIN, Bruce J, KRABBENHOFT, Roger S
Published in IEEE transactions on advanced packaging (01.02.2005)
Published in IEEE transactions on advanced packaging (01.02.2005)
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Conference Proceeding
Manufacturing a product using a soldering process
Chamberlin, Bruce J, Huber, Andreas, Winkel, Thomas-Michael, Huels, Harald
Year of Publication 23.03.2021
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Year of Publication 23.03.2021
Patent
Compliant pin with self sensing deformation
Kuczynski, Joseph, Chamberlin, Bruce, King, Scott B, Kelly, Matthew S
Year of Publication 08.09.2020
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Year of Publication 08.09.2020
Patent
COMPLIANT PIN WITH SELF SENSING DEFORMATION
Kuczynski, Joseph, Chamberlin, Bruce, King, Scott B, Kelly, Matthew S
Year of Publication 02.04.2020
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Year of Publication 02.04.2020
Patent
Selective dielectric resin application on circuitized core layers
Chamberlin, Bruce J, Kuczynski, Joseph, King, Scott B, Kelly, Matthew S
Year of Publication 16.11.2021
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Year of Publication 16.11.2021
Patent
First- and second-level packaging of the z990 processor cage
Winkel, T.-M., Becker, W. D., Harrer, H., Pross, H., Kaller, D., Garben, B., Chamberlin, B. J., Kuppinger, S. A.
Published in IBM journal of research and development (01.05.2004)
Published in IBM journal of research and development (01.05.2004)
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Journal Article
Glass-free dielectric layers for printed circuit boards
Chamberlin, Bruce J, Kuczynski, Joseph, Zhang, Jing, Wertz, Jason T, Czaplewski-Campbell, Sarah K
Year of Publication 20.04.2021
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Year of Publication 20.04.2021
Patent
Glass fiber coatings for improved resistance to conductive anodic filament formation
Chamberlin, Bruce J, Kuczynski, Joseph, King, Scott B, Kelly, Matthew S
Year of Publication 23.02.2021
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Year of Publication 23.02.2021
Patent