Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
Se-Ho You, Seonghwan Jeon, Dan Oh, Kilsoo Kim, Jaechoon Kim, Seung-Yong Cha, GyoungBum Kim
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Memory characteristics of Al2O3/LaAlO3/SiO2 multilayer structures with tunnel oxide thickness variation
Cha, Seung-Yong, Kim, Hyo-June, Choi, Doo-Jin
Published in Journal of materials science (01.10.2010)
Published in Journal of materials science (01.10.2010)
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Journal Article
성인둔상환자에서 평균동맥압과 위해사건발생의 관련성: 단면 조사 연구
차승용, Seung Yong Cha, 김용환, Yong Hwan Kim, 홍종근, Chong Kun Hong, 이준호, Jun Ho Lee, 조광원, Kwang Won Cho, 황성연, Seong Youn Hwang, 이경렬, Kyoung Yul Lee, 이영환, Young Hwan Lee, 최성희, Seong Hee Choi
Published in Daehan oe'sang haghoeji (30.06.2013)
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Published in Daehan oe'sang haghoeji (30.06.2013)
Journal Article
Power Integrity Performance Gain of a Novel Integrated Stack Capacitor (ISC) Solution for High-end Computing Applications
Song, Eunseok, Oh, Dan Kyung Suk, Cha, Seung-Yong, Jang, Jaejune, Hwang, Taejoo, Kim, Gyoungbum, Kim, Jongkook, Min, Sunghwan, Kim, Kilsoo, Kim, Dae-Woo, Yoon, Seungwook
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Multi-cyclone dust collecting apparatus and vaccum cleaner having the same
CHA SEUNG YONG, KIM SEE HYUN, JANG YUN SOO, HAN JUNG GYUN, CHOI IN GYU, LEE DO KYUNG
Year of Publication 21.02.2020
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Year of Publication 21.02.2020
Patent
Electrical and Thermal Co-Analysis of Thermally Efficient SiP for High Performance Applications
Kim, Sang Kyu, Oh, DanKyung Suk, Hwang, Seungtae, Lee, Bang Weon, Cha, Seung Yong, Kim, Tae Hun
Published in 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) (01.12.2019)
Published in 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) (01.12.2019)
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Conference Proceeding
SEMICONDUCTOR PACKAGE
MOON, HYUN JONG, KIM, KEUNG BEUM, LEE, HEE SEOK, KIM, YONG HOON, CHA, SEUNG YONG
Year of Publication 23.05.2016
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Year of Publication 23.05.2016
Patent
SEMICONDUCTOR
MOON, HYUN JONG, KIM, KEUNG BEUM, LEE, HEE SEOK, KIM, YONG HOON, JUNG, YOON HA, CHA, SEUNG YONG, KIM, TONG SUK, EUM, TAI HYUN
Year of Publication 23.06.2016
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Year of Publication 23.06.2016
Patent
Accuracy of objective parameters in acute epiglottitis diagnosis: A case-control study
Kim, Kyung Hee, Kim, Yong Hwan, Lee, Jun Ho, Lee, Dong Woo, Song, Yun Gyu, Cha, Seung Yong, Hwang, Seong Youn
Published in Medicine (Baltimore) (01.09.2018)
Published in Medicine (Baltimore) (01.09.2018)
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Journal Article