Inorganic interposer for multi-chip packaging
Sobieski, Daniel, Lee, Kyu Oh, Qian, Zhiguo, Darmawikarta, Kristof, Celikkol, Merve, Aygun, Kemal, Boyapati, Sri Ranga Sai
Year of Publication 23.06.2020
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Year of Publication 23.06.2020
Patent
INORGANIC INTERPOSER FOR MULTI-CHIP PACKAGING
Sobieski, Daniel, Lee, Kyu Oh, Qian, Zhiguo, Darmawikarta, Kristof, Celikkol, Merve, Aygun, Kemal, Boyapati, Sri Ranga Sai
Year of Publication 23.08.2018
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Year of Publication 23.08.2018
Patent
INORGANIC INTERPOSER FOR MULTI-CHIP PACKAGING
SOBIESKI, Daniel, BOYAPATI, Sri Ranga Sai, QIAN, Zhiguo, LEE, Kyu Oh, DARMAWIKARTA, Kristof, CELIKKOL, Merve, AYGUN, Kemal
Year of Publication 09.03.2017
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Year of Publication 09.03.2017
Patent
Inorganic interposer for multi-chip packaging
BOYAPATI, SRI RANGA SAI, LEE, KYU OH, AYGUN, KEMAL, DARMAWIKARTA, KRISTOF, CELIKKOL, MERVE, SOBIESKI, DANIEL, QIAN, ZHIGUO
Year of Publication 21.07.2020
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Year of Publication 21.07.2020
Patent
INORGANIC INTERPOSER FOR MULTI-CHIP PACKAGING
QIAN ZHIGUO, LEE KYU-OH, AYGUN KEMAL, BOYAPATI SRI RANGA SAI, CELIKKOL MERVE, DARMAWIKARTA KRISTOF, SOBIESKI DANIEL
Year of Publication 03.08.2018
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Year of Publication 03.08.2018
Patent
Inorganic interposer for multi-chip packaging
BOYAPATI, SRI RANGA SAI, AYGUN, KEMAL, DARMAWIKARTA, KRISTOF, CELIKKOL, MERVE, QIAN, ZHI-GUO, SOBIESKI, DANIEL, LEE, KYU-OH
Year of Publication 01.06.2017
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Year of Publication 01.06.2017
Patent