Search Results - "CATABAY, Wilbur" :: K.UTB vyhledávací portál

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Plasma cleaning process for openings formed in at least one low dielectric constant insulation layer over copper metallization in integrated circuit structures

by CATABAY WILBUR G, HSIA WEI-JEN, ZHAO JOE W
Year of Publication 20.03.2001

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PLASMA WASHING METHOD FOR OPENING PART FORMED IN MORE THAN ONE SMALL RELATIVE PERMITTIVITY INSULATING LAYER ON COPPER METAL COATING OF INTEGRATED CIRCUIT STRUCTURE

by CATABAY WILBUR G, HSIA WEI-JEN, ZHAO JOE W
Year of Publication 30.11.2000

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PROCESS FOR PREVENTING MOISTURE ABSORPTION BY TREATING DAMAGED SURFACE OF LOW DIELECTRIC CONSTANT ORGANIC OXIDE SILICON INSULATING MATERIAL

by CATABAY WILBUR G, WANG ZHIHAI, ZHAO JOE W
Year of Publication 13.10.2000

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Plasma cleaning process for openings formed in one or more low dielectric constant insulation layers over copper metallization integrated circuit structures

by CATABAY, WILBUR G, HSIA, WEI-JEN, ZHAO, JOE W
Year of Publication 04.10.2000

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Dual layer barrier film techniques to prevent resist poisoning

by LU HONG-QIANG, CATABAY WILBUR G, HSIA WEI-JEN
Year of Publication 16.12.2004

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Dual layer barrier film techniques to prevent resist poisoning

by LU HONG-QIANG, CATABAY WILBUR G, HSIA WEI-JEN
Year of Publication 02.11.2004

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Interconnect dielectric tuning

by LO WAI, GU SHIQUN, CATABAY WILBUR G, WANG ZHIHAI, HSIA WEI-JEN, LIN HONG
Year of Publication 25.07.2006

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Process for treating damaged surfaces of low dielectric constant organo silicon oxide insulation material to inhibit moisture absorption

by CATABAY; WILBUR G, ZHAO; JOE W, WANG; ZHIHAI
Year of Publication 22.02.2000

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Method and structure for forming dielectric layers having reduced dielectric constants

by LU HONG-QIANG, CATABAY WILBUR G, HSIA WEI-JEN
Year of Publication 10.08.2004

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Low dielectric constant silicon oxide-based dielectric layer for integrated circuit structures having improved compatibility with via filler materials, and method of making same

by Catabay, Wilbur G, Hsia, Wei-Jen, Li, Weidan, Zhao, Joe W
Year of Publication 29.06.2004

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Low dielectric constant silicon oxide-based dielectric layer for integrated circuit structures having improved compatibility with via filler materials, and method of making same

by CATABAY WILBUR G, LI WEIDAN, HSIA WEI-JEN, ZHAO JOE W
Year of Publication 29.06.2004

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Interconnect dielectric tuning

by LO WAI, GU SHIQUN, CATABAY WILBUR G, WANG ZHIHAI, HSIA WEI-JEN, LIN HONG
Year of Publication 16.02.2006

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Consistent alignment mark profiles on semiconductor wafers using PVD shadowing

by DOU; SHUMAY X, ZHAO; JOE W, CATABAY; WILBUR
Year of Publication 20.07.1999

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FORMING METHOD OF TITANIUM NITRIDE BARRIER LAYER AND SEMICONDUCTOR DEVICE CONTAINING TITANIUM NITRIDE BARRIER LAYER

by CATABAY WILBUR G, HSIA WEI-JEN, ZHAO JOE W
Year of Publication 02.06.1999

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Process for forming improved cobalt silicide layer on integrated circuit structure using two capping layers

by YOSHIKAWA; STEPHANIE A, CATABAY; WILBUR G, WANG; ZHIHAI
Year of Publication 11.05.1999

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Method to obtain a low resistivity and conformity chemical vapor deposition titanium film

by CATABAY; WILBUR G, ZHAO; JOE W, HSIA; WEI-JEN
Year of Publication 20.04.1999

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METHOD AND DEVICE FOR VAPOR-DEPOSITING TITANIUM NITRIDE ON SUBSTRATE BY CHEMICAL VAPOR DEPOSITION METHOD

by CATABAY WILBUR G, HSIA WEI-JEN, ZHAO JOE W
Year of Publication 13.11.1998

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METHOD FOR FORMING IMPROVED COBALT SILICIDE LAYER ON INTEGRATED CIRCUIT STRUCTURE USING TWO CAPPING LAYERS

by CATABAY WILBUR G, STEPHANIE A YOSHIKAWA, WANG ZHIHAI
Year of Publication 23.10.1998

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IMPROVED BARRIER LAYER FOR VIA OR CONTACT APERTURE OF INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURE THEREOF

by CATABAY WILBUR G, WANG ZHIHAI, ZHAO JOE W
Year of Publication 07.08.1998

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Method for eliminating peeling at end of semiconductor substrate in metal organic chemical vapor deposition of titanium nitride

by CATABAY; WILBUR G, ZHAO; JOE W, HSIA; WEI-JEN
Year of Publication 04.08.1998

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