Fabrication and packaging of microbump interconnections for 3D TSV
Seung Wook Yoon, Jae Hoon Ku, Suthiwongsunthorn, N., Marimuthu, P.C., Carson, F.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
The development of the Fan-in Package-on-Package
Carson, F., Seong Min Lee, In Sang Yoon
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Advanced SiP Packaging Technologies of IPD for Mobile Applications
PRASHANT, Meenakshi, SEUNG WOOK YOON, KIM, Geunsik, KAI LIU, CARSON, Flynn
Published in Journal of microelectronics and electronic packaging (01.10.2010)
Published in Journal of microelectronics and electronic packaging (01.10.2010)
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Journal Article
Flexible package architecture concept in fanout
Zhai, Jun, Shanmugam, Karthik, Camenforte, Raymundo M, Carson, Flynn P, Li, Menglu
Year of Publication 27.08.2024
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Year of Publication 27.08.2024
Patent
Molded Silicon on Passive Package
Shanmugam, Karthik, Camenforte, Raymundo M, Nagarajan, Kumar, Carson, Flynn P, Li, Menglu, Morrison, Scott D
Year of Publication 08.06.2023
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Year of Publication 08.06.2023
Patent
Cell packaging techniques
McCambridge, John M, Bohney, Nathan J, Manenti, Antonio, Wilson, Jonathan C, Marasco, Angelo V, Gooch, Scott L, Carson, Flynn P, Mayer, Laura E
Year of Publication 01.10.2024
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Year of Publication 01.10.2024
Patent
Wafer-level passive array packaging
Shanmugam, Karthik, Camenforte, Raymundo M, Carson, Flynn P, Agrawal, Rakshit, Morrison, Scott D, Dhaliwal, Kiranjit
Year of Publication 19.07.2022
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Year of Publication 19.07.2022
Patent
FLEXIBLE PACKAGE ARCHITECTURE CONCEPT IN FANOUT
LI, Menglu, SHANMUGAM, Karthik, CAMENFORTE, Raymundo M, CARSON, Flynn P, ZHAI, Jun
Year of Publication 27.05.2022
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Year of Publication 27.05.2022
Patent
Flexible Package Architecture Concept in Fanout
Zhai, Jun, Shanmugam, Karthik, Camenforte, Raymundo M, Carson, Flynn P, Li, Menglu
Year of Publication 19.05.2022
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Year of Publication 19.05.2022
Patent
Wafer-Level Passive Array Packaging
Shanmugam, Karthik, Camenforte, Raymundo M, Carson, Flynn P, Agrawal, Rakshit, Morrison, Scott D, Dhaliwal, Kiranjit
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent