Design, fabrication and test of a bulk SiC MEMS accelerometer
Zhai, Yanxin, Li, Haiwang, Tao, Zhi, Cao, Xiaoda, Yang, Chunhui, Che, Zhizhao, Xu, Tiantong
Published in Microelectronic engineering (01.05.2022)
Published in Microelectronic engineering (01.05.2022)
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Journal Article
A Capacitive Pressure Sensor Seamlessly Embedded in the Microchannel
Cao, Xiaoda, Tao, Zhi, Li, Haiwang, Fang, Weidong, Zhai, Yanxin, Xu, Tiantong
Published in IEEE sensors journal (15.09.2024)
Published in IEEE sensors journal (15.09.2024)
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Journal Article
Temperature Characteristics of 4H-SiC Substrate and Thin-Film Resistor Applied in MEMS Piezoresistive Sensors
Zhai, Yanxin, Xu, Tiantong, Xu, Guoqiang, Cao, Xiaoda, Tao, Zhi, Li, Haiwang
Published in IEEE sensors journal (15.12.2023)
Published in IEEE sensors journal (15.12.2023)
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Journal Article
Application of bulk silicon carbide technology in high temperature MEMS sensors
Zhai, Yanxin, Li, Haiwang, Wu, Hanxiao, Tao, Zhi, Xu, Guoqiang, Cao, Xiaoda, Xu, Tiantong
Published in Materials science in semiconductor processing (01.04.2024)
Published in Materials science in semiconductor processing (01.04.2024)
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Journal Article
Simulation Analysis and Fabrication of a Silicon Carbide-Based Piezoresistive Accelerometer
Zhai, Yanxin, Li, Haiwang, Tao, Zhi, Yang, Chunhui, Cao, Xiaoda, Che, Zhizhao, Xu, Tiantong
Published in Journal of physics. Conference series (01.04.2022)
Published in Journal of physics. Conference series (01.04.2022)
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Journal Article
Identification of soybean seed varieties based on hyperspectral image
Tan, Kezhu, Chai, Yuhua, Song, Weixian, Cao, Xiaoda
Published in Nong ye gong cheng xue bao (01.05.2014)
Published in Nong ye gong cheng xue bao (01.05.2014)
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Journal Article
Design and Manufacture of a MEMS Capacitive Differential Pressure Sensor with High Linearity and Low Sensitivity
An, Di, Li, Haiwang, Cao, Xiaoda, Zhai, Yanxin, Xu, Tiantong
Published in 2024 IEEE 19th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) (02.05.2024)
Published in 2024 IEEE 19th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) (02.05.2024)
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Conference Proceeding
Application of Embedded Capacitive Pressure Sensors in Pressure Drop Measurement of Microchannels
Cao, Xiaoda, Xu, Tiantong, Tao, Zhi, Li, Haiwang, Zhai, Yanxin
Published in 2024 IEEE 19th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) (02.05.2024)
Published in 2024 IEEE 19th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) (02.05.2024)
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Conference Proceeding
Fabrication of Mems Bulk Sic-Based Accelerometer and its Application in Ground Test of Aero-Engine
Zhai, Yanxin, Xu, Tiantong, Xu, Guoqiang, Wang, Hengyi, Cao, Xiaoda, Li, Haiwang
Published in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (25.06.2023)
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Published in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (25.06.2023)
Conference Proceeding
Direct Simulation Analysis of Electromechanical Coupling and Joule Heating Effect of a MEMS SiC Piezoresistive Accelerometer
Zhai, Yanxin, Xu, Tiantong, Xu, Guoqiang, Cao, Xiaoda, Yang, Chunhui, Li, Haiwang
Published in 2022 9th International Forum on Electrical Engineering and Automation (IFEEA) (04.11.2022)
Published in 2022 9th International Forum on Electrical Engineering and Automation (IFEEA) (04.11.2022)
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Conference Proceeding
ULTRA-MICRO VOICE COIL MOTOR BASED ON MICRO-ELECTRO-MECHANICAL SYSTEM THREE-DIMENSIONAL COIL
XU, Tiantong, ZHAI, Yanxin, WANG, Wenbin, FANG, Weidong, LI, Haiwang, ZHU, Kaiyun, TAO, Zhi, ZHANG, Xiao, WU, Yuying, LEI, Kaibo, CAO, Xiaoda
Year of Publication 26.01.2023
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Year of Publication 26.01.2023
Patent
MEMS Electromagnetic Motor and Manufacturing Method Thereof
WENBIN WANG, TIANTONG XU, XIAO ZHANG, KAIBO LEI, XIAODA CAO, YANXIN ZHAI, YUYING WU, KAIYUN ZHU, WEIDONG FANG, ZHI TAO, HAIWANG LI
Year of Publication 24.11.2022
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Year of Publication 24.11.2022
Patent
Capacitive pressure difference sensor with improved bonding and manufacturing method
Zhu, Kaiyun, Wang, Zhiyang, Lei, Kaibo, Cao, Xiaoda, Xiao, Wensong, An, Di, Wang, Wenbin, Fang, Weidong, Wang, Hengyi, Yang, Chunhui, Zhang, Xiao, Zhai, Yanxin, Lu, Haonan, Li, Haiwang, Li, Murun, Xu, Tiantong, Tao, Zhi, Feng, Yang
Year of Publication 17.10.2023
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Year of Publication 17.10.2023
Patent