Synthesis of Ag3Sn Submicrometer Particles via an Adapted Polyol Process in View of Their Use As Die-Attach Material in Power Modules
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Published in Journal of electronic materials (01.07.2019)
Published in Journal of electronic materials (01.07.2019)
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Journal Article
FORMULATION D'UN COMPOSE INTERMETALLIQUE AG-SN
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Year of Publication 22.07.2022
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FORMULATION OF AN AG-SN INTERMETALLIC COMPOUND
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Year of Publication 21.04.2021
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FORMULATION OF AN AG-SN INTERMETALLIC COMPOUND
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Year of Publication 02.10.2019
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Year of Publication 02.10.2019
Patent
Formulation of Ag-Sn intermetallic compound
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Year of Publication 23.07.2019
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Year of Publication 23.07.2019
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FORMULATION OF AN AG-SN INTERMETALLIC COMPOUND
TAN, Ky Lim, MAROTEAUX, Fadila, SCHOENSTEIN, Frédéric, MORELLE, Jean-Michel, JOUINI, Noureddine, CANAUD, Pauline
Year of Publication 31.05.2018
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Year of Publication 31.05.2018
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FORMULATION D'UN COMPOSE INTERMETALLIQUE AG-SN
CANAUD, PAULINE, MORELLE, JEAN-MICHEL, TAN, KY LIM, SCHOENSTEIN, FREDERIC, JOUINI, NOUREDDINE, MAROTEAUX, FADILA
Year of Publication 25.05.2018
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Year of Publication 25.05.2018
Patent