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Year of Publication 30.08.2023
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Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
ANTI-REFLECTION WITH INTERCONNECTED STRUCTURES
CHENG, Chia-hung Calvin, SAHRAEI KHANGHAH, Nasim, DAUZOU, Fabien Paul Jacques, KASHI, Siamak
Year of Publication 05.05.2022
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Year of Publication 05.05.2022
Patent
ANTI-REFLECTION WITH INTERCONNECTED STRUCTURES
CHENG, CHIA-HUNG CALVIN, KASHI, SIAMAK, DAUZOU, FABIEN PAUL JACQUES, SAHRAEI KHANGHAH, NASIM
Year of Publication 05.05.2022
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Year of Publication 05.05.2022
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Published in 2012 IEEE International Conference on Robotics and Automation (01.05.2012)
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Conference Proceeding
Wafer Level Reliability Characterization of 2.5D IC packages
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Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
Copper wire bond reliability evaluation using a modular test chip
Trigg, A. D., Chai Tai Chong, Fen, S. Y. P., Kwee, J. L. T., Ming, C. C. H., Mung, S. C. S., Ping, C., Ganesh, V. P., Low, B., Chu, T. L., Leng, E. P.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding