LEADFRAME SEMICONDUCTOR PACKAGE AND METHOD
CALO PAUL ARMAND ASENTISTA, CHUA KOK YAU, SAW KHAY CHWAN, CHIANG CHAU FATT, LEE SWEE KAH, HOEGLAUER JOSEF
Year of Publication 17.02.2020
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Year of Publication 17.02.2020
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WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
CALO PAUL ARMAND A, MALDO TIBURCIO A, SON, JOON SEO, ALMAGRO ERWIN IAN V, RIOS MARGIE T
Year of Publication 22.04.2010
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Year of Publication 22.04.2010
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Semiconductor Packages and Methods for Manufacturing Thereof
Piller, Andreas, Calo, Paul Armand, Goa, Joo Ming, Bemmerl, Thomas, Macheiner, Stefan, Tay, Wee Boon, Dinkel, Markus, Myers, Edward
Year of Publication 30.03.2023
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Year of Publication 30.03.2023
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LEADFRAME, SEMICONDUCTOR PACKAGE AND METHOD
CHUA, Kok Yau, SAW, Khay Chwan, CHIANG, Chau Fatt, LEE, Swee Kah, CALO, Paul Armand Asentista, HOEGLAUER, Josef
Year of Publication 05.10.2022
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Year of Publication 05.10.2022
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Electrical interconnect structure with radial spokes for improved solder void control
Gan, Tek Keong, Keh, Ser Yee, Stadler, Michael, Lem, Tien Heng, Calo, Paul Armand Asentista, Lim, Fong, Tay, Mei Qi
Year of Publication 07.06.2022
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Year of Publication 07.06.2022
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Gestapeltes Transistorchip-Package mit Source-Kopplung
Yuferev, Sergey, Ng, Chee Yang, Palm, Petteri, Long, Theng Chao, Calo, Paul Armand Asentista, Maerz, Josef, Yong, Wae Chet
Year of Publication 21.04.2022
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Year of Publication 21.04.2022
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METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USING A SOLDERLESS JOINT
CHUA, Kok Yau, CHA, Chan Lam, NARAYANASAMY, Jayaganasan, LONG, Theng Chao, CHIANG, Chau Fatt, LEE, Swee Kah, LEE, Chee Hong, SAW, Khay Chwan Andrew, CALO, Paul Armand Asentista
Year of Publication 01.09.2022
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Year of Publication 01.09.2022
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SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR CHIP, AND METHOD OF FORMING A CHIP SYSTEM
JASON LIM, Wee Aun, DINKEL, Markus, ZHUANG, Hao, BLANK, Oliver, Schlögel, Xaver, TEOH, Hooi Boon, CALO, Paul Armand, Nöbauer, Gerhard Thomas, Pölzl, Martin, TAN, Chee Voon, SAM, Ying Pok, Höglauer, Josef, OTREMBA, Ralf, Hölzl, Daniel
Year of Publication 20.07.2023
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Year of Publication 20.07.2023
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Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control
Gan, Tek Keong, Keh, Ser Yee, Stadler, Michael, Lem, Tien Heng, Calo, Paul Armand Asentista, Lim, Fong, Tay, Mei Qi
Year of Publication 29.07.2021
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Year of Publication 29.07.2021
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STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING
PALM, Petteri, YUFEREV, Sergey, MAERZ, Josef, YONG, Wae Chet, NG, Chee Yang, LONG, Theng Chao, CALO, Paul Armand Asentista
Year of Publication 21.04.2022
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Year of Publication 21.04.2022
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