Paving the way toward the world's first 200mm SiC pilot line
Musolino, Mattia, Xu, Xueping, Wang, Hui, Rengarajan, Varathajan, Zwieback, Ilya, Ruland, Gary, Crippa, Danilo, Mauceri, Marco, Calabretta, Michele, Messina, Angelo
Published in Materials science in semiconductor processing (15.11.2021)
Published in Materials science in semiconductor processing (15.11.2021)
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Journal Article
Warpage Behavior on Silicon Semiconductor Device: The Impact of Thick Copper Metallization
Calabretta, Michele, Sitta, Alessandro, Oliveri, Salvatore Massimo, Sequenzia, Gaetano
Published in Applied sciences (01.06.2021)
Published in Applied sciences (01.06.2021)
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Journal Article
Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy
Dahrouch, Zainab, Malta, Giuliana, d’Ambrosio, Moreno, Messina, Angelo Alberto, Musolino, Mattia, Sitta, Alessandro, Calabretta, Michele, Patanè, Salvatore
Published in Applied sciences (01.05.2024)
Published in Applied sciences (01.05.2024)
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Journal Article
Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter
Mauromicale, Giuseppe, Sitta, Alessandro, Calabretta, Michele, Oliveri, Salvatore Massimo, Sequenzia, Gaetano
Published in Applied sciences (01.09.2021)
Published in Applied sciences (01.09.2021)
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Journal Article
TIMs for transfer molded power modules: Characterization, reliability, and modeling
Sitta, Alessandro, Mauromicale, Giuseppe, Malgioglio, Giuseppe Luigi, Amoroso, Davide Maria, Schifano, Biagio, Calabretta, Michele, Sequenzia, Gaetano
Published in Microelectronics and reliability (01.09.2023)
Published in Microelectronics and reliability (01.09.2023)
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Journal Article
Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices
Sitta, Alessandro, Mauromicale, Giuseppe, Corrente, Giovanni, Messina, Angelo Alberto, Rundo, Francesco, Calabretta, Michele, Sequenzia, Gaetano
Published in Microelectronics and reliability (01.11.2022)
Published in Microelectronics and reliability (01.11.2022)
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Journal Article
Development of n-type epitaxial growth on 200 mm 4H-SiC wafers for the next generation of power devices
Musolino, Mattia, Carria, Egidio, Crippa, Danilo, Preti, Silvio, Azadmand, Mani, Mauceri, Marco, Isacson, Mathias, Calabretta, Michele, Messina, Angelo
Published in Microelectronic engineering (01.04.2023)
Published in Microelectronic engineering (01.04.2023)
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Journal Article
Study of the Thermomechanical Strain Induced by Current Pulses in SiC-Based Power MOSFET
Anoldo, Laura, Triolo, Claudia, Panarello, Saverio, Garesci, Francesca, Russo, Sebastiano, Messina, Angelo Alberto, Calabretta, Michele, Patane, Salvatore
Published in IEEE electron device letters (01.07.2021)
Published in IEEE electron device letters (01.07.2021)
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Journal Article
Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions
Mirone, Giuseppe, Barbagallo, Raffaele, Bua, Giuseppe, Sitta, Alessandro, Calabretta, Michele, Sequenzia, Gaetano
Published in IOP conference series. Materials Science and Engineering (01.05.2024)
Published in IOP conference series. Materials Science and Engineering (01.05.2024)
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Journal Article
An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization
Calabretta, Michele, Sitta, Alessandro, Oliveri, Salvatore Massimo, Sequenzia, Gaetano
Published in International journal on interactive design and manufacturing (01.03.2021)
Published in International journal on interactive design and manufacturing (01.03.2021)
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Journal Article
Effects of Hydrogen Bonding in Silicon Nitride/Polyimide Passivation Bilayer in SiC Power Devices
Scandurra, Antonino, Bellocchi, Gabriele, Arena, Giuseppe, Rascunà, Simone, Calabretta, Michele, Boscaglia, Massimo, Saggio, Mario, Mineo, Giacometta, Iacono, Valentina, Boscarino, Stefano, Mirabella, Salvatore, Ruffino, Francesco, Grimaldi, Maria Grazia
Published in Physica status solidi. A, Applications and materials science (01.09.2024)
Published in Physica status solidi. A, Applications and materials science (01.09.2024)
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Journal Article