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Published in Journal of cardiovascular pharmacology (01.05.2006)
Published in Journal of cardiovascular pharmacology (01.05.2006)
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Journal Article
Fan-Out Panel Level Package with Fine Pitch Pattern
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Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Multi-layered package substrate manufactured by reel-to-reel processes
Park, Jongwoo, Jung, Myungki, Kim, Yongnam, Kwon, Soon-Chul, Lee, Sangmin, Kim, Daewook, Byun, Jungsoo
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Samung Fan-out Panel Level Package Solutions
Kim, Yonghoon, Lee, Doohwan, Hur, Youngsik, Byun, Jungsoo, Cho, Taeje, Kang, Sayoon
Published in 2019 Electron Devices Technology and Manufacturing Conference (EDTM) (01.03.2019)
Published in 2019 Electron Devices Technology and Manufacturing Conference (EDTM) (01.03.2019)
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Conference Proceeding
Semiconductor package, and package on package having the same
Lee, Doohwan, Shim, Jongbo, Byun, Jungsoo, Choi, Junggon, Yim, Choongbin, Kim, Jungwoo, Kim, Jihwang, Choi, Kyoungsei, Pyo, Sungeun
Year of Publication 14.02.2023
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Year of Publication 14.02.2023
Patent
SEMICONDUCTOR PACKAGE, AND PACKAGE ON PACKAGE HAVING THE SAME
SHIM, Jongbo, Lee, Doohwan, Byun, Jungsoo, Choi, Junggon, Yim, Choongbin, Kim, Jungwoo, Kim, Jihwang, Choi, Kyoungsei, Pyo, Sungeun
Year of Publication 19.08.2021
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Year of Publication 19.08.2021
Patent