Semiconductor wafer coat layers and methods therefor
Li, Eric J, Lu, Daoqiang, Rumer, Christopher L, Koning, Paul A, Fleming, Darcy E, Oskarsdottir, Gudbjorg H, Byrne, Tiffany
Year of Publication 05.06.2012
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Year of Publication 05.06.2012
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Semiconductor wafer coat layers and methods therefor
Li, Eric J, Lu, Daoqiang, Rumer, Christopher L, Koning, Paul A, Fleming, Darcy E, Oskarsdottir, Gudbjorg H, Byrne, Tiffany
Year of Publication 01.03.2011
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Year of Publication 01.03.2011
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Semiconductor wafer coat layers and methods therefor
LU DAOQIANG, BYRNE TIFFANY, RUMER CHRISTOPHER L, KONING PAUL A, FLEMING DARCY E, OSKARSDOTTIR GUDBJORG H, LI ERIC J
Year of Publication 05.06.2012
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Year of Publication 05.06.2012
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SEMICONDUCTOR WAFER COAT LAYERS AND METHODS THEREFOR
LU DAOQIANG, BYRNE TIFFANY, RUMER CHRISTOPHER L, KONING PAUL A, FLEMING DARCY E, OSKARSDOTTIR GUDBJORG H, LI ERIC J
Year of Publication 10.03.2011
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Year of Publication 10.03.2011
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Semiconductor wafer coat layers and methods therefor
LU DAOQIANG, BYRNE TIFFANY, RUMER CHRISTOPHER L, KONING PAUL A, FLEMING DARCY E, OSKARSDOTTIR GUDBJORG H, LI ERIC J
Year of Publication 01.03.2011
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Year of Publication 01.03.2011
Patent
Semiconductor wafer coat layers and methods therefor
Li, Eric J, Lu, Daoqiang, Rumer, Christopher L, Koning, Paul A, Fleming, Darcy E, Oskarsdottir, Gudbjorg H, Byrne, Tiffany
Year of Publication 09.10.2007
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Year of Publication 09.10.2007
Patent
Semiconductor wafer coat layers and methods therefor
LU DAOQIANG, BYRNE TIFFANY, RUMER CHRISTOPHER L, KONING PAUL A, FLEMING DARCY E, OSKARSDOTTIR GUDBJORG H, LI ERIC J
Year of Publication 09.10.2007
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Year of Publication 09.10.2007
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Semiconductor wafer coat layers and methods therefor
LU DAOQIANG, BYRNE TIFFANY, RUMER CHRISTOPHER L, KONING PAUL A, FLEMING DARCY E, OSKARSDOTTIR GUDBJORG H, LI ERIC J
Year of Publication 20.09.2007
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Year of Publication 20.09.2007
Patent
Semiconductor wafer coat layers and methods therefor
LU DAOQIANG, BYRNE TIFFANY, RUMER CHRISTOPHER L, KONING PAUL A, FLEMING DARCY E, OSKARSDOTTIR GUDBJORG H, LI ERIC J
Year of Publication 05.10.2006
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Year of Publication 05.10.2006
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Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
Suh, Daewoong, Jayaraman, Saikumar, Lehman, Stephen E, Patel, Mitesh, Byrne, Tiffany A, Martin, Edward L, Basiron, Mohd Erwan B, Loh, Wei Keat, Lim, Sheau Hooi, Chin, Yoong Tatt P
Year of Publication 06.11.2007
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Year of Publication 06.11.2007
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Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
PATEL MITESH, LIM SHEAU HOOI, MARTIN EDWARD L, JAYARAMAN SAIKUMAR, CHIN YOONG TATT P, SUH DAEWOONG, BYRNE TIFFANY A, LOH WEI KEAT, LEHMAN STEPHEN E, BASIRON MOHD ERWAN B
Year of Publication 06.11.2007
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Year of Publication 06.11.2007
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STRESS-RELIEF LAYERS AND STRESS-COMPENSATION COLLARS WITH LOW-TEMPERATURE SOLDERS FOR BOARD-LEVEL JOINTS, AND PROCESSES OF MAKING SAME
PATEL MITESH, MARTIN EWARD L, LOH WEI K, JAYARAMAN SAIKUMAR, CHIN YOONG TATT P, SUH DAEWOONG, BYRNE TIFFANY A, LIM SHEAU H, LEHMAN STEPHEN E, BASIRON MOHD ERWAN B
Year of Publication 16.08.2007
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Year of Publication 16.08.2007
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Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
Suh, Daewoong, Jayaraman, Saikumar, Lehman, Stephen E, Patel, Mitesh, Byrne, Tiffany A, Martin, Edward L, Basiron, Mohd Erwan B, Loh, Wei Keat, Lim, Sheau Hooi, Chin, Yoong Tatt P
Year of Publication 07.08.2007
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Year of Publication 07.08.2007
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