RayChip®: Real-time ray-tracing chip for embedded applications
Woo-Chan Park, Hee-Jin Shin, Byoungok Lee, Hyungmin Yoon, Tack-Don Han
Published in 2014 IEEE Hot Chips 26 Symposium (HCS) (01.08.2014)
Published in 2014 IEEE Hot Chips 26 Symposium (HCS) (01.08.2014)
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Conference Proceeding
The evaluation of flowability and wire sweep by epoxy molding compound for power module packages using Moldflow
Taekkeun Lee, Aimee Lim, Youngsun Ko, Taewoo Lee, Byoungok Lee
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
Design and assembly process simulation for an automotive power module
Yong Liu, Qiuxiao Qian, Byoungok Lee, Taekkeun Lee, Joonseo Son, Oseob Jeon
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Full thermal parametric model for power WL-CSP design
Zhongfa Yuan, Yong Liu, Martin, S., England, L., Byoungok Lee
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
Patent
Integrated circuit direct cooling systems having substrates in contact with a cooling medium
Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 23.04.2024
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Year of Publication 23.04.2024
Patent
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 24.03.2022
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Year of Publication 24.03.2022
Patent
Semiconductor package having a spacer with a junction cooling pipe
Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 14.12.2021
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Year of Publication 14.12.2021
Patent