INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 11.06.2020
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Year of Publication 11.06.2020
Patent
Semiconductor package having junction cooling pipes embedded in substrates
Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 31.03.2020
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Year of Publication 31.03.2020
Patent
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 01.11.2018
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Year of Publication 01.11.2018
Patent
A novel methodology for thermal characterization of power packages in high current applications
Lee, ByoungOk, A-Rom Moon, JoonSeo Son, JiHwan Kim
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
Semiconductor package
DUKYONG LEE, SEUNGWON IM, OSEOB JEON, YOONSOO LEE, BYOUNGOK LEE, JOONSEO SON, CHANGYOUNG PARK
Year of Publication 21.12.2018
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Year of Publication 21.12.2018
Patent