by Kim, Byongjin, Lee, Euehun
Published in Inquiry (Chicago) (01.01.2022)

by Kim, ByongJin, Jeon, HyeongIl, Park, DaeYoung, Kim, GiJeong, Cho, Nam-Hee, Khim, JinYoung
Published in Journal of advanced joining processes (01.06.2022)

by Kim, Byongjin, Lee, Euehun, Jo, Sang Hyun
Published in Informatics for health & social care (03.04.2023)

by Kim, ByongJin, Jeon, HyeongIl, Kim, GiJeong, Bang, WonBae, Khim, JinYoung
Published in Microelectronics international (17.03.2023)

by HoJeong Lim, JeongKyu Yang, HeeYeon Ku, ChongGeun Ahn, TaeYong Lee, ByongJin Kim, JiYong Chung
Published in 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) (01.05.2016)

by Kim, ByongJin, Bolotnikov, Alexander, Jeong, Helen, Kim, Chandong, Das, Hrishkesh, Ponram, Ganesh
Published in 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (07.03.2023)

by Park, DaeYoung, Jeon, HyeongIl, Kim, GiJeong, Yang, JiYeon, Sang, KwangSoo, Kim, ByongJin, Khim, JinYoung
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)