A Novel 94-GHz MHMET-Based Diode Mixer Using a 3-dB Tandem Coupler
Mun-Kyo Lee, Byeong-Ok Lim, Sang-Jin Lee, Dong-Sik Ko, Sung-Woon Moon, An, D., Yong-Hoh Kim, Sam-Dong Kim, Hyun-Chang Park, Jin-Koo Rhee
Published in IEEE microwave and wireless components letters (01.09.2008)
Published in IEEE microwave and wireless components letters (01.09.2008)
Get full text
Journal Article
Novel Bumping Material for Solder‐on‐Pad Technology
Choi, Kwang‐Seong, Chu, Sun‐Woo, Lee, Jong‐Jin, Sung, Ki‐Jun, Bae, Hyun‐Cheol, Lim, Byeong‐Ok, Moon, Jong‐Tae, Eom, Yong‐Sung
Published in ETRI journal (01.08.2011)
Published in ETRI journal (01.08.2011)
Get full text
Journal Article
Novel Maskless Bumping for 3D Integration
Choi, Kwang‐Seong, Sung, Ki‐Jun, Lim, Byeong‐Ok, Bae, Hyun‐Cheol, Jung, Sunghae, Moon, Jong‐Tae, Eom, Yong‐Sung
Published in ETRI journal (01.04.2010)
Published in ETRI journal (01.04.2010)
Get full text
Journal Article
Low conversion loss and high LO-RF isolation 94-GHz active down converter
Bok-Hyung Lee, An, D., Mun-Kyo Lee, Byeong-Ok Lim, Jung-Hun Oh, Kim, S.-D., Jin-Koo Rhee, Jung-Dong Park, Sang-Yong Yi
Published in IEEE transactions on microwave theory and techniques (01.06.2006)
Published in IEEE transactions on microwave theory and techniques (01.06.2006)
Get full text
Journal Article
Two-stage broadband high-gain W-band amplifier using 0.1-μm metamorphic HEMT technology
Bok-Hyung Lee, An, D., Mun-Kyo Lee, Byeong-Ok Lim, Kim, S.-D., Jin-Koo Rhee
Published in IEEE electron device letters (01.12.2004)
Published in IEEE electron device letters (01.12.2004)
Get full text
Journal Article
Hybrid ring coupler for W-band MMIC applications using MEMS technology
Sung-Chan Kim, Baek-Seok Ko, Tae-Jong Baek, Byeong-Ok Lim, An, D., Dong-Hoon Shin, Jin-Koo Rhee
Published in IEEE microwave and wireless components letters (01.10.2005)
Published in IEEE microwave and wireless components letters (01.10.2005)
Get full text
Journal Article
High switching performance 0.1-μm metamorphic HEMTs for low conversion loss 94-GHz resistive mixers
An, D., Bok-Hyung Lee, Byeong-Ok Lim, Mun-Kyo Lee, Sung-Chan Kim, Jung-Hun Oh, Kim, S.-D., Hyung-Moo Park, Dong-Hoon Shin, Jin-Koo Rhee
Published in IEEE electron device letters (01.10.2005)
Published in IEEE electron device letters (01.10.2005)
Get full text
Journal Article
Growth and analysis of modulation-doped AlGaN/GaN heterostructure on semi-insulating SiC substrate
Kim, Dong-Seok, Won, Chul-Ho, Kim, Ryun-Hwi, Lim, Byeong-Ok, Choi, Gil-Wong, Lee, Bok-Hyung, Kim, Hyoung-Joo, Hong, In-Pyo, Lee, Jung-Hee
Published in Journal of crystal growth (01.06.2014)
Published in Journal of crystal growth (01.06.2014)
Get full text
Journal Article
W-band resistive mixer using metamorphic HEMT
Baek, Yong-Hyun, Lee, Bok-Hyung, Oh, Jung-Hun, Lim, Byeong-Ok, Dan-An, Park, Jung-Dong, Kim, Sam-Dong, Rhee, Jin-Koo
Published in Current applied physics (01.09.2006)
Published in Current applied physics (01.09.2006)
Get full text
Journal Article
Effect of a two-step recess process using atomic layer etching on the performance of In0.52Al0.48As/In0.53Ga0.47As p-HEMTs
KIM, Tae-Woo, KIM, Dae-Hyun, SANG DUK PARK, GEUN YOUNG YEOM, BYEONG OK LIM, RHEE, Jin-Koo, JANG, Jae-Hyung, SONG, Jong-In
Published in IEEE electron device letters (01.12.2007)
Published in IEEE electron device letters (01.12.2007)
Get full text
Journal Article
Design and fabrication of a 180° hybrid ring coupler inserted into a slow-wave structure for MMIC applications using dielectric-supported air-gapped microstriplines
Lim, Byeong-Ok, Ko, Baek-Seok, Baek, Tae-Jong, Kim, Sung-Chan, Shin, Dong-Hoon, Rhee, Jin-Koo
Published in Microwave and optical technology letters (05.12.2005)
Published in Microwave and optical technology letters (05.12.2005)
Get full text
Journal Article
Novel Bumping Material for Solder-on-Pad Technology
Choi, Kwang-Seong, Chu, Sun-Woo, Lee, Jong-Jin, Sung, Ki-Jun, Bae, Hyun-Cheol, Lim, Byeong-Ok, Moon, Jong-Tae, Eom, Yong-Sung
Published in ETRI journal (30.08.2011)
Get full text
Published in ETRI journal (30.08.2011)
Journal Article
Novel Maskless Bumping for 3D Integration
Choi, Kwang-Seong, Sung, Ki-Jun, Lim, Byeong-Ok, Bae, Hyun-Cheol, Jung, Sung-Hae, Moon, Jong-Tae, Eom, Yong-Sung
Published in ETRI journal (30.04.2010)
Get full text
Published in ETRI journal (30.04.2010)
Journal Article
The Fabrication of the Low Loss Transmission Line and Low Pass Filter using Surface Microelectromechanical Systems Technology
Lee, Han-Shin, Shin, Dong-Hoon, Kim, Sung-Chan, Lim, Byeong-Ok, Baek, Tae-Jong, Ko, Baek-Seok, Chun, Young-Hoon, Kim, Soon-Koo, Park, Hyun-Chung, Rhee, Jin-Koo
Published in Japanese Journal of Applied Physics (2004)
Published in Japanese Journal of Applied Physics (2004)
Get full text
Journal Article
50-nm T-Gate InAlAs/InGaAs Metamorphic HEMTs With Low Noise and High f Characteristics
Lim, Byeong Ok, Lee, Mun Kyo, Baek, Tae Jong, Han, Min, Kim, Sung Chan, Rhee, Jin-Koo
Published in IEEE electron device letters (01.07.2007)
Published in IEEE electron device letters (01.07.2007)
Get full text
Journal Article
High-performance 94-GHz single balanced mixer using 70-nm MHEMTs and surface micromachined technology
Sung Chan Kim, An, D., Byeong Ok Lim, Tae Jong Baek, Dong Hoon Shin, Jin Koo Rhee
Published in IEEE electron device letters (01.01.2006)
Published in IEEE electron device letters (01.01.2006)
Get full text
Journal Article
Effects of Gate-Recess Structure on High-Frequency Characteristics of 0.1 μm Metamorphic HEMTs
Oh, Jung-Hun, Baek, Yong-Hyun, Lim, Byeong-Ok, Moon, Sung-Woon, Lee, Sang-Jin, Rhee, Jin-Koo, Hwang, In-Seok, Kim, Sam-Dong
Published in Journal of the Electrochemical Society (2007)
Published in Journal of the Electrochemical Society (2007)
Get full text
Journal Article
Effect of a Two-Step Recess Process Using Atomic Layer Etching on the Performance of \hbox\hbox\hbox\hbox\hbox p-HEMTs
Kim, Tae-Woo, Kim, Dae-Hyun, Park, Sang Duk, Yeom, Geun Young, Lim, Byeong Ok, Rhee, Jin-Koo, Jang, Jae-Hyung, Song, Jong-In
Published in IEEE electron device letters (01.12.2007)
Published in IEEE electron device letters (01.12.2007)
Get full text
Journal Article
Optimized TSV process using bottom-up electroplating without wafer cracks
Byeong-Ok Lim, Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, Sunghae Jung, Ki-Jun Sung, Jong-Tae Moon
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Get full text
Conference Proceeding
3D SiP module using TSV and novel solder bump maker
Hyun-Cheol Bae, Kwang-Seong Choi, Yong-Sung Eom, Byeong-Ok Lim, Ki-Jun Sung, Sunghae Jung, Byeung-Gee Kim, In-Soo Kang, Jong-Tae Moon
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Get full text
Conference Proceeding