Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors
Rao, Prahalad K., Bhushan, M. Brij, Bukkapatnam, Satish T. S., Zhenyu Kong, Byalal, Sanjay, Beyca, Omer F., Fields, Adam, Komanduri, Ranga
Published in IEEE transactions on semiconductor manufacturing (01.02.2014)
Published in IEEE transactions on semiconductor manufacturing (01.02.2014)
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