State of the art of high temperature power electronics
Buttay, Cyril, Planson, Dominique, Allard, Bruno, Bergogne, Dominique, Bevilacqua, Pascal, Joubert, Charles, Lazar, Mihai, Martin, Christian, Morel, Hervé, Tournier, Dominique, Raynaud, Christophe
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.03.2011)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.03.2011)
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Journal Article
Thermal Stability of Silicon Carbide Power Diodes
Buttay, C., Raynaud, C., Morel, H., Civrac, G., Locatelli, M-L, Morel, F.
Published in IEEE transactions on electron devices (01.03.2012)
Published in IEEE transactions on electron devices (01.03.2012)
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Journal Article
Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding
Mouawad, B., Soueidan, M., Fabregue, D., Buttay, C., Allard, B., Bley, V., Morel, H., Martin, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2012)
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Journal Article
Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective
Qin, Yuan, Albano, Benjamin, Spencer, Joseph, Lundh, James Spencer, Wang, Boyan, Buttay, Cyril, Tadjer, Marko, DiMarino, Christina, Zhang, Yuhao
Published in Journal of physics. D, Applied physics (02.03.2023)
Published in Journal of physics. D, Applied physics (02.03.2023)
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Journal Article
Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability
Xiao, Ming, Wang, Boyan, Liu, Jingcun, Zhang, Ruizhe, Zhang, Zichen, Ding, Chao, Lu, Shengchang, Sasaki, Kohei, Lu, Guo-Quan, Buttay, Cyril, Zhang, Yuhao
Published in IEEE transactions on power electronics (01.08.2021)
Published in IEEE transactions on power electronics (01.08.2021)
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Journal Article
Thermal Management and Electromagnetic Analysis for GaN Devices Packaging on DBC Substrate
Chenjiang Yu, Buttay, Cyril, Laboure, Eric
Published in IEEE transactions on power electronics (01.02.2017)
Published in IEEE transactions on power electronics (01.02.2017)
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Journal Article
Low Thermal Resistance (0.5 K/W) Ga₂O₃ Schottky Rectifiers With Double-Side Packaging
Wang, Boyan, Xiao, Ming, Knoll, Jack, Buttay, Cyril, Sasaki, Kohei, Lu, Guo-Quan, Dimarino, Christina, Zhang, Yuhao
Published in IEEE electron device letters (01.08.2021)
Published in IEEE electron device letters (01.08.2021)
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Journal Article
Surge current capability of ultra-wide-bandgap Ga2O3 Schottky diodes
Buttay, Cyril, Wong, Hiu-Yung, Wang, Boyan, Xiao, Ming, Dimarino, Christina, Zhang, Yuhao
Published in Microelectronics and reliability (01.11.2020)
Published in Microelectronics and reliability (01.11.2020)
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Journal Article
12-kV 1-kA Breaking Capable Modular Power Electronic Interrupter With Staged Turn-off Strategy for Medium-Voltage DC Hybrid Circuit Breaker
Liu, Jian, Ravi, Lakshmi, Buttay, Cyril, Burgos, Rolando, Schmalz, Steve, Schroedermeier, Andy, Shen, Z. John, Dong, Dong
Published in IEEE transactions on industry applications (01.09.2022)
Published in IEEE transactions on industry applications (01.09.2022)
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Journal Article
Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials
Lu, Shengchang, Zhang, Zichen, Buttay, Cyril, Ngo, Khai, Lu, Guo-Quan
Published in IEEE transactions on power electronics (01.06.2022)
Published in IEEE transactions on power electronics (01.06.2022)
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Journal Article
Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3-D Concept
Marchesini, Jean-Louis, Jeannin, Pierre-Olivier, Avenas, Yvan, Delaine, Johan, Buttay, Cyril, Riva, Raphael
Published in IEEE transactions on industry applications (01.01.2017)
Published in IEEE transactions on industry applications (01.01.2017)
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Journal Article
SiC power devices packaging with a short-circuit failure mode capability
Dchar, Ilyas, Buttay, Cyril, Morel, Hervé
Published in Microelectronics and reliability (01.09.2017)
Published in Microelectronics and reliability (01.09.2017)
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Journal Article
Packaged Ga 2 O 3 Schottky Rectifiers With Over 60-A Surge Current Capability
Xiao, Ming, Wang, Boyan, Liu, Jingcun, Zhang, Ruizhe, Zhang, Zichen, Ding, Chao, Lu, Shengchang, Sasaki, Kohei, Lu, Guo-Quan, Buttay, Cyril, Zhang, Yuhao
Published in IEEE transactions on power electronics (01.08.2021)
Published in IEEE transactions on power electronics (01.08.2021)
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Journal Article
Surge Current Interruption Capability of Discrete IGBT Devices in DC Hybrid Circuit Breakers
Ravi, Lakshmi, Liu, Jian, Liu, Jingcun, Zhang, Yuhao, Buttay, Cyril, Schmalz, Steven, Burgos, Rolando, Dong, Dong
Published in IEEE journal of emerging and selected topics in power electronics (01.06.2023)
Published in IEEE journal of emerging and selected topics in power electronics (01.06.2023)
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Journal Article
Physics-based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs
Avino-Salvado, O., Buttay, C., Bonet, F., Raynaud, C., Bevilacqua, P., Rebollo, J., Morel, H., Perpina, X.
Published in IEEE transactions on industrial electronics (1982) (01.05.2024)
Published in IEEE transactions on industrial electronics (1982) (01.05.2024)
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Journal Article