Search Results - "Bunt, Jay A" :: K.UTB vyhledávací portál

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Tamper-respondant assembly with structural material within sealed inner compartment

by Jay A Bunt, Junjun Li, Hongqing Zhang, Zhigang Song, Guoda Lian, Shidong Li
Year of Publication 24.05.2023

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High power device fault localization via die surface contouring

by Oldrey, Richard Walter, Tran, Phong T, Bunt, Jay A, Pompeo, Frank L, Lewison, David J, Sylvestri, John D
Year of Publication 26.03.2024

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Non-destructive bond line thickness measurement of thermal interface material on silicon packages

by Molinelli Acocella, Joyce, Luo, Yu, Bunt, Jay A, Zhang, Hongqing, Lewison, David J
Year of Publication 28.03.2023

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FILTER DEVICE HAVING MULTIPLE CHANGEABLE FILTER SURFACES

by Boettcher, Steven H, Polgrean, Heather Nicole, Bunt, Jay A, VanDeventer, Allan Cory, Sunder, Madhana, Zhang, Hongqing, Molinelli Acocella, Joyce E
Year of Publication 30.11.2023

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Tamper-respondant assembly with structural material within sealed inner compartment

by Jay A Bunt, Junjun Li, Hongqing Zhang, Zhigang Song, Guoda Lian, Shidong Li
Year of Publication 28.09.2022

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Tamper-respondent assemblies with porous heat transfer element(s)

by Campbell, Levi, Higby, Arthur J, Bunt, Jay A, Buchling Rego, Philipp K, Zhang, Hongqing, Lewison, David J, Busby, James
Year of Publication 01.08.2023

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Coolant-cooled heat sink(s) with associated ultra-violet light assembly

by Bunt, Jay A, Ellsworth, Jr., Michael J, Zhang, Hongqing, Sunder, Madhana, Pompeo, Frank L, Lewison, David J, Busby, James, Molinelli Acocella, Joyce E
Year of Publication 11.06.2024

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Lid/heat spreader having targeted flexibility

by Li, Shidong, Bunt, Jay A, Toy, Hilton, Zhang, Hongqing, Lewison, David J, Marston, Kenneth C
Year of Publication 30.08.2022

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High power device fault localization via die surface contouring

by John D Sylvestri, Jay A Bunt, Richard Walter Oldrey, David J Lewison, Frank L Pompeo, Phong T Tran
Year of Publication 01.02.2023

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Tamper-respondent assembly with structural material within sealed inner compartment

by Lian, Guoda, Bunt, Jay A, Li, Shidong, Zhang, Hongqing, Li, Junjun, Song, Zhigang
Year of Publication 30.11.2021

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TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)

by HIGBY, Arthur J, BUSBY, James, LEWISON, David J, BUCHLING REGO, Philipp K, BUNT, Jay A, ZHANG, Hongqing, CAMPBELL, Levi
Year of Publication 16.06.2022

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High power device fault localization via die surface contouring

by John D Sylvestri, Jay A Bunt, Richard Walter Oldrey, David J Lewison, Frank L Pompeo, Phong T Tran
Year of Publication 08.06.2022

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HIGH POWER DEVICE FAULT LOCALIZATION VIA DIE SURFACE CONTOURING

by Oldrey, Richard Walter, Tran, Phong T, Bunt, Jay A, Pompeo, Frank L, Lewison, David J, Sylvestri, John D
Year of Publication 19.05.2022

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NON-DESTRUCTIVE BOND LINE THICKNESS MEASUREMENT OF THERMAL INTERFACE MATERIAL ON SILICON PACKAGES

by Molinelli Acocella, Joyce, Luo, Yu, Bunt, Jay A, Zhang, Hongqing, Lewison, David J
Year of Publication 29.04.2021

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COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSEMBLY

by ELLSWORTH, JR., Michael J, BUSBY, James, LEWISON, David J, MOLINELLI ACOCELLA, Joyce E, POMPEO, Frank L, BUNT, Jay A, SUNDER, Madhana, ZHANG, Hongqing
Year of Publication 03.11.2022

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COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSEMBLY

by ELLSWORTH, JR, BUSBY, James, LEWISON, David J, MOLINELLI ACOCELLA, Joyce E, POMPEO, Frank L, BUNT, Jay A, SUNDER, Madhana, ZHANG, Hongqing
Year of Publication 03.11.2022

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