Integration of a low stress photopatternable silicone into a wafer level package
Gardner, G., Harkness, B., Ohare, E., Meynen, H., Bulcke, M.V., Gonzalez, M., Beyne, E.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Spray coating of photoresist for realizing through-wafer interconnects
Pham, N.P., Bulcke, M.V., De Moor, P.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier
Bulcke, M.V., Baert, K., Beyne, E., Gonzalez, M., Winters, C., Webers, T.
Published in 2006 International Conference of the IEEE Engineering in Medicine and Biology Society (2006)
Published in 2006 International Conference of the IEEE Engineering in Medicine and Biology Society (2006)
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Conference Proceeding
Journal Article
Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
Gonzalez, M., Bulcke, M.V., Vandevelde, B., Beyne, E., Lee, Y., Harkness, B., Meynen, H.
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
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Conference Proceeding
An analysis of the reliability of a wafer level package (WLP) using a silicone under the bump (SUB) configuration
Gonzalez, M., Vandevelde, B., BuIcke, M.V., Winters, C., Beyne, E., Lee, Y.I., Larson, L., HArkness, B.R., Mohamed, M., Meynen, H., Vanlathem, E.
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding