SAC 305 solder paste with carbon nanotubes - part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties
Bukat, K, Sitek, J, Ko cielski, M, Jakubowska, M, S oma, M, M o niak, A, Nied wied, W
Published in Soldering & surface mount technology (01.01.2012)
Published in Soldering & surface mount technology (01.01.2012)
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Journal Article
Investigation of the effect of indium addition on wettability of Sn-Ag-Cu solders
Moser, Z, Fima, P, Bukat, K, Sitek, J, Pstru, J, G sior, W, Ko cielski, M, Gancarz, T
Published in Soldering & surface mount technology (01.01.2011)
Published in Soldering & surface mount technology (01.01.2011)
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Journal Article
Pb-Free Solders: Part 1. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions
Moser, Z., Gąsior, W., Bukat, K., Pstruś, J., Kisiel, R., Sitek, J., Ishida, K., Ohnuma, I.
Published in Journal of phase equilibria and diffusion (01.04.2006)
Published in Journal of phase equilibria and diffusion (01.04.2006)
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Journal Article
A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits
Ročak, D., Maček, S., Sitek, J., Hrovat, M., Bukat, K., Drozd, Z.
Published in Microelectronics and reliability (01.06.2007)
Published in Microelectronics and reliability (01.06.2007)
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Journal Article
Investigation of Sn-Zn-Bi solders - Part II: wetting measurements on Sn-Zn7Bi solders on copper and on PCBs with lead-free finishes by means of the wetting balance method
Bukat, K, Sitek, J, Ko cielski, M, Moser, Z, G sior, W, Pstru, J
Published in Soldering & surface mount technology (01.01.2010)
Published in Soldering & surface mount technology (01.01.2010)
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Journal Article
(Sn-Ag)eut + Cu Soldering Materials, Part I: Wettability Studies
Gasior, W., Moser, Z., Pstruś, J., Bukat, K., Kisiel, R., Sitek, J.
Published in Journal of phase equilibria and diffusion (01.04.2004)
Published in Journal of phase equilibria and diffusion (01.04.2004)
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Journal Article
Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions
Moser, Z., Gasior, W., Bukat, K., Pstruś, J., Kisiel, R., Sitek, J., Ishida, K., Ohnuma, I.
Published in Journal of phase equilibria and diffusion (01.10.2007)
Published in Journal of phase equilibria and diffusion (01.10.2007)
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Journal Article
Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance - ANOVA
Bukat, K, Sitek, J, Kisiel, R, Moser, Z, Gasior, W, Ko cielski, M, Pstru, J
Published in Soldering & surface mount technology (01.01.2008)
Published in Soldering & surface mount technology (01.01.2008)
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Journal Article
(Sn-Ag)eut + Cu Soldering Materials, Part II: Electrical and Mechanical Studies
Kisiel, R., Gasior, W., Moser, Z., Pstruś, J., Bukat, K., Sitek, J.
Published in Journal of phase equilibria and diffusion (01.04.2004)
Published in Journal of phase equilibria and diffusion (01.04.2004)
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Journal Article
Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additions
Ohnuma, I., Ishida, K., Moser, Z., Gąsior, S., Bukat, K., Pstruś, J., Kisiel, R., Sitek, J.
Published in Journal of phase equilibria and diffusion (01.06.2006)
Published in Journal of phase equilibria and diffusion (01.06.2006)
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Journal Article
Pb-Free solders: Part 1. Wettability testing of Sn−Ag−Cu alloys with Bi additions
Moser, Z., Gąsior, W., Bukat, K., Pstruś, J., Kisiel, R., Sitek, J., Ishida, K., Ohnuma, I.
Published in Journal of phase equilibria and diffusion (01.03.2006)
Published in Journal of phase equilibria and diffusion (01.03.2006)
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Journal Article
(Sn-Ag)eut+Cu soldering materials, part I: Wettability studies
Gasior, W., Moser, Z., Pstruś, J., Bukat, K., Sitek, J., Kisiel, R.
Published in Journal of phase equilibria and diffusion (01.04.2004)
Published in Journal of phase equilibria and diffusion (01.04.2004)
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Journal Article
Phase relations in the system Cu-Eu-O and thermodynamic properties of CuEu2O4 and CuEuO2
Kisiel, R., Gasior, W., Moser, Z., Pstruś, J., Bukat, K., Sitek, J.
Published in Journal of phase equilibria and diffusion (01.04.2004)
Published in Journal of phase equilibria and diffusion (01.04.2004)
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Journal Article
Comparison of new no-clean fluxes on PCBs and thick film hybrid circuits
Ročak, D., Bukat, K., Zupan, M., Fajfar-Plut, J., Tadić, V.
Published in Microelectronics (01.09.1999)
Published in Microelectronics (01.09.1999)
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Journal Article
Investigation of SnZnBi solders Part II wetting measurements on SnZn7Bi solders on copper and on PCBs with leadfree finishes by means of the wetting balance method
Bukat, K., Sitek, J., Kocielski, M., Moser, Z., Gsior, W., Pstru, J.
Published in Soldering & surface mount technology (21.09.2010)
Published in Soldering & surface mount technology (21.09.2010)
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Journal Article
Evaluation of the influence of Bi and Sb additions to SnAgCu and SnZn alloys on their surface tension and wetting properties using analysis of variance ANOVA
Bukat, K., Sitek, J., Kisiel, R., Moser, Z., Gasior, W., Kocielski, M., Pstru, J.
Published in Soldering & surface mount technology (19.09.2008)
Published in Soldering & surface mount technology (19.09.2008)
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Journal Article
Phase relations in the system Cu-Eu-O and thermodynamic properties of CuEu^sub 2^O^sub 4^ and CuEuO2
Kisiel, R, Gasior, W, Moser, Z, Pstru, J, Bukat, K, Sitek, J
Published in Journal of phase equilibria and diffusion (01.04.2004)
Published in Journal of phase equilibria and diffusion (01.04.2004)
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