Organic chemistry on a polyimide surface
Thomas, Richard R, Buchwalter, Stephen L, Buchwalter, L. Paivikki, Chao, Taina H
Published in Macromolecules (01.08.1992)
Published in Macromolecules (01.08.1992)
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Journal Article
The complementary redox properties of viologens and pyromellitimides: a new class of organic conductors [Erratum to document cited in CA114(4):31765e]
Buchwalter, Stephen L, Iyengar, Revathi, Viehbeck, Alfred, O'Toole, Alfred, Terrence, R
Published in Journal of the American Chemical Society (01.07.1991)
Published in Journal of the American Chemical Society (01.07.1991)
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Journal Article
The complementary redox properties of viologens and pyromellitimides: a new class of organic conductors [Erratum to document cited in CA114(4):31765e]
Buchwalter, Stephen L, Iyengar, Revathi, Viehbeck, Alfred, O'Toole, Terrence R
Published in Journal of the American Chemical Society (01.03.1991)
Published in Journal of the American Chemical Society (01.03.1991)
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Journal Article
REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD
ANDRY PAUL S, KNICKERBOCKER JOHN U, KATOPSIS GEORGE A, TSAPEPAS STELIOS G, WEBB BUCKNELL C, BUCHWALTER STEPHEN L
Year of Publication 08.11.2010
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Year of Publication 08.11.2010
Patent
Ultrasonic-assisted solder transfer
Gruber, Peter A, Buchwalter, Stephen L, Nah, Jae-Woong, Shih, Da-Yuan, Lauro, Paul Alfred
Year of Publication 03.01.2023
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Year of Publication 03.01.2023
Patent
Effects of mechanical stress and moisture on packaging interfaces
Buchwalter, S. L., Brofman, P. J., Feger, C., Gaynes, M. A., Lee, K.-W., Matienzo, L. J., Questad, D. L.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Journal Article
Combination polyimide decal with a rigid mold
Gruber, Peter A, Buchwalter, Stephen L, Nah, Jae-Woong, Shih, Da-Yuan, Lauro, Paul Alfred
Year of Publication 08.03.2022
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Year of Publication 08.03.2022
Patent
Continuous solder transfer to substrates
Gruber, Peter A, Buchwalter, Stephen L, Nah, Jae-Woong, Shih, Da-Yuan, Lauro, Paul Alfred
Year of Publication 07.09.2021
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Year of Publication 07.09.2021
Patent
ULTRASONIC-ASSISTED SOLDER TRANSFER
Gruber, Peter A, Buchwalter, Stephen L, Nah, Jae-Woong, Shih, Da-Yuan, Lauro, Paul Alfred
Year of Publication 29.07.2021
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Year of Publication 29.07.2021
Patent
COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD
Gruber, Peter A, Buchwalter, Stephen L, Nah, Jae-Woong, Shih, Da-Yuan, Lauro, Paul Alfred
Year of Publication 20.05.2021
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Year of Publication 20.05.2021
Patent
C4NP Lead Free Solder Bumping and 3D Micro Bumping
Busby, J., Dang, B., Gruber, P., Hawken, D., Shah, J., Weisman, R., Perfecto, E., Ruhmer, K., Buchwalter, S.
Published in 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01.05.2008)
Published in 2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01.05.2008)
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Conference Proceeding
Injection molded microoptics
Gruber, Peter A, Shih, Da-Yuan, DeCusatis, Casimer, Jacobowitz, Lawrence, Buchwalter, Stephen
Year of Publication 10.11.2020
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Year of Publication 10.11.2020
Patent
CONTINUOUS SOLDER TRANSFER TO SUBSTRATES
Gruber, Peter A, Buchwalter, Stephen L, Nah, Jae-Woong, Shih, Da-Yuan, Lauro, Paul Alfred
Year of Publication 08.10.2020
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Year of Publication 08.10.2020
Patent
INJECTION MOLDED MICROOPTICS
Gruber, Peter A, Shih, Da-Yuan, DeCusatis, Casimer, Jacobowitz, Lawrence, Buchwalter, Stephen
Year of Publication 16.01.2020
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Year of Publication 16.01.2020
Patent
Injection molded microoptics
Gruber, Peter A, Shih, Da-Yuan, Jacobwitz, Lawrence, DeCusatis, Casimer, Buchwalter, Stephen
Year of Publication 26.11.2019
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Year of Publication 26.11.2019
Patent