Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Journal Article
A high performance liner for copper damascene interconnects
Edelstein, D., Uzoh, C., Cabral, C., DeHaven, P., Buchwalter, P., Simon, A., Cooney, E., Malhotra, S., Klaus, D., Rathore, H., Agarwala, B., Nguyen, D.
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
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Conference Proceeding
Reaction of polyaniline with NMP at elevated temperatures
Afzali, A., Buchwalter, S.L., Buchwalter, L.P., Hougham, G.
Published in Polymer (Guilford) (01.08.1997)
Published in Polymer (Guilford) (01.08.1997)
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Journal Article
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias
Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Buchwalter, L.P., Sprogis, E.J., Hua Gan, Horton, R.R., Polastre, R.J., Wright, S.L., Cotte, J.M.
Published in IEEE journal of solid-state circuits (01.08.2006)
Published in IEEE journal of solid-state circuits (01.08.2006)
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Journal Article
Conference Proceeding
Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling
Zhmurkin, D. V., Gross, T. S., Buchwalter, L. P.
Published in Journal of electronic materials (01.07.1997)
Published in Journal of electronic materials (01.07.1997)
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Journal Article
Adhesion test standardization for multichip module packages
Shih, D.-Y., Kim, J., Buchwalter, P., Lauro, P., Clearfield, H., Lee, K.-W., Paraszczak, J., Purushothaman, S., Viehbeck, A., Kamath, S., Lund, C., Tong, H.M., Anschel, M., Lacombe, R.
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
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Conference Proceeding
Journal Article
Organic chemistry on a polyimide surface
Thomas, Richard R, Buchwalter, Stephen L, Buchwalter, L. Paivikki, Chao, Taina H
Published in Macromolecules (01.08.1992)
Published in Macromolecules (01.08.1992)
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Journal Article
Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods
Jahnes, C.V., Cotte, J., Lund, J.L., Deligianni, H., Chinthakindi, A., Buchwalter, L.P., Fryer, P., Tornello, J.A., Hoivik, N., Magerlein, J.H., Seeger, D.
Published in 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest (2004)
Published in 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest (2004)
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Conference Proceeding
Interfacial sliding in Cu/Ta/polymide high density interconnects as a result of thermal cycling
Zhmurkin, D V, Gross, T S, Buchwalter, L P
Published in Journal of electronic materials (01.07.1997)
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Published in Journal of electronic materials (01.07.1997)
Journal Article
PLASMA TREATMENT TO ENHANCE INORGANIC DIELECTRIC ADHESION TO COPPER
ANTHONY K. STAMPER, PAUL D. AGNELLO, BARBARA J. LUTHER, JOHN PATRICK HUMMEL, LEENA P. BUCHWALTER
Year of Publication 24.07.2001
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Year of Publication 24.07.2001
Patent
A CMOS-compatible process for fabricating electrical through-vias in silicon
Andry, P.S., Tsang, C., Sprogis, E., Patel, C., Wright, S.L., Webb, B.C., Buchwalter, L.P., Manzer, D., Horton, R., Polastre, R., Knickerbocker, J.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
Wright, S.L., Polastre, R., Gan, H., Buchwalter, L.P., Horton, R., Andry, P.S., Sprogis, E., Patel, C., Tsang, C., Knickerbocker, J., Lloyd, J.R., Sharma, A., Sri-Jayantha, M.S.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Thermomechanical deformation of 1 mu m thick Cu-polymide line arrays studied by scanning probe microscopy
Zhmurkin, D V, Gross, T S, Buchwalter, L P, Kaufman, F B
Published in Journal of electronic materials (01.01.1996)
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Published in Journal of electronic materials (01.01.1996)
Journal Article
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
ANDRY PAUL S, HORTON RAYMOND R, GOMA SHERIF A, SPROGIS EDMUND J, FARINELLI MATTHEW J, BUCHWALTER LEENA P
Year of Publication 19.04.2012
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Year of Publication 19.04.2012
Patent