Real-world gait and turning in individuals scheduled for total knee arthroplasty
Boekesteijn, Ramon J., Keijsers, Noël L.W., Defoort, Koen, Mancini, Martina, Bruning, Frank J., El-Gohary, Mahmoud, Geurts, Alexander C.H., Smulders, Katrijn
Published in Clinical biomechanics (Bristol) (01.10.2024)
Published in Clinical biomechanics (Bristol) (01.10.2024)
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Journal Article
The effect of Ni on the kinetics of electroless Cu film deposition
Logan, Eric, Sharma, Tanu, Brüning, Frank, Zarwell, Sebastian, Steinhäuser, Edith, Bernhard, Tobias, Chen, Ning, Brüning, Ralf
Published in Thin solid films (31.03.2017)
Published in Thin solid films (31.03.2017)
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Journal Article
In Situ Vibrational Probes of Epoxy Gelation
Granado, Lérys, Kempa, Stefan, Gregoriades, Laurence John, Brüning, Frank, Genix, Anne-Caroline, Bantignies, Jean-Louis, Fréty, Nicole, Anglaret, Eric
Published in ACS macro letters (20.08.2019)
Published in ACS macro letters (20.08.2019)
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Journal Article
Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications
Granado, Lérys, Kempa, Stefan, Gregoriades, Laurence John, Brüning, Frank, Bernhard, Tobias, Flaud, Valérie, Anglaret, Eric, Fréty, Nicole
Published in ACS applied electronic materials (27.08.2019)
Published in ACS applied electronic materials (27.08.2019)
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Journal Article
ASSOCIATION BETWEEN REAL WORLD GAIT AND PAIN IN INDIVIDUALS SCHEDULED FOR TOTAL KNEE ARTHROPLASTY: FEASIBILITY STUDY
Bruning, Frank, van de Ven, Myrthe P., van Mierlo, Michelle, Vriezekolk, Johanna E., van den Ende, Cornelia H., Koëter, Sander, Smulders, Katrijn
Published in Osteoarthritis and cartilage (01.04.2024)
Published in Osteoarthritis and cartilage (01.04.2024)
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Journal Article
229 - ASSOCIATION BETWEEN REAL WORLD GAIT AND PAIN IN INDIVIDUALS SCHEDULED FOR TOTAL KNEE ARTHROPLASTY: FEASIBILITY STUDY
Bruning, Frank, van de Ven, Myrthe P., van Mierlo, Michelle, Vriezekolk, Johanna E., van den Ende, Cornelia H., Koëter, Sander, Smulders, Katrijn
Published in Osteoarthritis and cartilage (01.04.2024)
Published in Osteoarthritis and cartilage (01.04.2024)
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Journal Article
The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films
Bernhard, Tobias, Zarwell, Sebastian, Massey, Roger, Steinhäuser, Edith, Kempa, Stefan, Branduuml, Frank
Published in Journal of microelectronics and electronic packaging (01.04.2021)
Published in Journal of microelectronics and electronic packaging (01.04.2021)
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Journal Article
Nickel dependence of hydrogen generation, hydrogen co-deposition and film stress in an electroless copper process
Sharma, Tanu, Landry, Alexandre E., Leger, Alexandre, Brown, Delilah A., Bernhard, Tobias, Zarwell, Sebastian, Brüning, Frank, Brüning, Ralf
Published in Thin solid films (30.11.2018)
Published in Thin solid films (30.11.2018)
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Journal Article
Kinetic regimes in the curing process of epoxy-phenol composites
Granado, Lérys, Kempa, Stefan, Gregoriades, Laurence J., Brüning, Frank, Genix, Anne-Caroline, Fréty, Nicole, Anglaret, Eric
Published in Thermochimica acta (10.09.2018)
Published in Thermochimica acta (10.09.2018)
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Journal Article
Nickel dependence of hydrogen co-deposition and nanoporosity in electrolessly deposited Cu-films
Bernhard, Tobias, Steinhauser, Edith, Kempa, Stefan, Krilles, Gerson, Massey, Roger, Bruning, Frank
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films
Bernhard, Tobias, Zarwell, Sebastian, Steinhauser, Edith, Kempa, Stefan, Bruning, Frank
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
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Conference Proceeding
Non-destructive DRIFT spectroscopy measurement of the degree of curing of industrial epoxy/silica composite buildup layers
Granado, Lérys, Maurin, David, Kempa, Stefan, Gregoriades, Laurence J., Brüning, Frank, Fréty, Nicole, Anglaret, Éric, Bantignies, Jean-Louis
Published in Polymer testing (01.09.2018)
Published in Polymer testing (01.09.2018)
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Journal Article
Stress of electroless copper deposits on insulating and metal substrates
Brüning, Ralf, Sibley, Allison, Sharma, Tanu, Brown, Delilah A., Demay, Thibault, Brüning, Frank, Bernhard, Tobias
Published in Thin solid films (28.08.2014)
Published in Thin solid films (28.08.2014)
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Journal Article
The effect of nickel on the strain evolution in chemical copper films
Bamberg, Simon, Perry, Laura K., Muir, Bruce, Abuzir, Alaaedeen, Brüning, Frank, Brüning, Ralf
Published in Thin solid films (30.09.2012)
Published in Thin solid films (30.09.2012)
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Journal Article
Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for Microelectronics
Granado, Lérys, Kempa, Stefan, Bremmert, Stefanie, Gregoriades, Laurence J., Brüning, Frank, Anglaret, Eric, Fréty, Nicole
Published in Journal of microelectronics and electronic packaging (01.04.2017)
Published in Journal of microelectronics and electronic packaging (01.04.2017)
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Journal Article
In-Situ Stress Determination of Electroless Cu on PCB-Relevant Substrates
Bernhard, Tobias, Bruning, Ralf, Sharma, Tanu, Brown, Delilah, Gregoriades, Laurence, Steinhaeuser, Edith, Kempa, Stefan, Bruning, Frank, Luy, Edward Alexandre
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding