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Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-Tall Indium Bumps Across an Entire Chip

by Schneider, Andreas, Koorikkat, Aswathi, Burt, David, Ghorbanian, Navid, Brookes, Toby G., Lipp, John D., French, Marcus J.
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)

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Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-Tall Indium Bumps Across an Entire Chip

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