Ultrasonic tool and ultrasonic connection device herein
Broekelmann, Michael, Unger, Andreas, Hunstig, Matthias, Hesse, Hans-Juergen
Year of Publication 24.09.2024
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Year of Publication 24.09.2024
Patent
Tactile tissue characterisation by piezoelectric systems
Stroop, Ralf, Uribe, David Oliva, Martinez, Melisa Orta, Brökelmann, Michael, Hemsel, Tobias, Wallaschek, Jörg
Published in Journal of electroceramics (01.08.2008)
Published in Journal of electroceramics (01.08.2008)
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Journal Article
WIRE GUIDE MODULE, AND ULTRASONIC WIRE BONDER THEREWITH
WALTHER, Frank, BROEKELMANN, Michael, UNGER, Andreas, HUNSTIG, Matthias
Year of Publication 20.04.2023
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Year of Publication 20.04.2023
Patent
ULTRASONIC TOOL AND ULTRASONIC CONNECTION DEVICE HEREIN
BROEKELMANN, Michael, UNGER, Andreas, HESSE, Hans-Juergen, HUNSTIG, Matthias
Year of Publication 23.06.2022
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Year of Publication 23.06.2022
Patent
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION
BROEKELMANN, Michael, UNGER, Andreas, HESSE, Hans-Juergen, HUNSTIG, Matthias
Year of Publication 23.06.2022
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Year of Publication 23.06.2022
Patent
BONDING ARRANGEMENT AND BONDING TOOL
BROEKELMANN, Michael, UNGER, Andreas, HESSE, Hans-Juergen, HUNSTIG, Matthias
Year of Publication 23.06.2022
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Year of Publication 23.06.2022
Patent
ULTRASONIC TOOL AND ULTRASONIC CONNECTION DEVICE THEREFOR
BROEKELMANN, Michael, UNGER, Andreas, HESSE, Hans-Juergen, HUNSTIG, Matthias
Year of Publication 23.06.2022
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Year of Publication 23.06.2022
Patent
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding
Dymel, Collin, Schemmel, Reinhard, Hemsel, Tobias, Sextro, Walter, Brokelmann, Michael, Hunstig, Matthias
Published in 2018 IEEE CPMT Symposium Japan (ICSJ) (01.11.2018)
Published in 2018 IEEE CPMT Symposium Japan (ICSJ) (01.11.2018)
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Conference Proceeding