Packaging design of the IBM System z10 Enterprise Class platform central electronic complex
Torok, J G, Bosco, F E, Brodsky, W L, Furey, E F, Goth, G F, Kearney, D J, Loparco, J J, Peets, M T, Pizzolato, K L, Porter, D W, Ruehle, G, White, W H
Published in IBM journal of research and development (01.01.2009)
Published in IBM journal of research and development (01.01.2009)
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Journal Article
Compression of Bonded Annular Rubber Blocks
Ling, Yun, Engel, Peter A, Brodsky, William L
Published in Journal of engineering mechanics (01.06.1995)
Published in Journal of engineering mechanics (01.06.1995)
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Journal Article
Featured elastomer design for connector applications
Brodsky, W.L., Knight, A.D., Macek, T.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Methodology for the determination of reliable separable contact interfaces
Brodsky, L., Mikhail, A.E., Plucinski, M.D.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Development of a 68-Pin Multiple In-Line Package
Brodsky, W., Parker, F., Schoenthaler, D.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1980)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1980)
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Journal Article