by Dompierre, B., Aubin, V., Charkaluk, E., Filho, W.C. Maia, Brizoux, M.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.05.2011)

by Dompierre, B., Maia Filho, W.C., Brizoux, M., Aubin, V., Charkaluk, E.
Published in Microelectronics and reliability (01.09.2010)

by Maia Filho, W.C., Brizoux, M., Frémont, H., Danto, Y.
Published in Microelectronics and reliability (01.09.2007)

by Filho, W.C. Maia, Brizoux, M., Frémont, H., Danto, Y.
Published in Microelectronics and reliability (01.09.2006)

by Kpobie, W., Martiny, M., Mercier, S., Lechleiter, F., Bodin, L., Lecavelier des Etangs-Levallois, A., Brizoux, M.
Published in Microelectronics and reliability (01.10.2016)

by Maia Filho, W C, Brizoux, M, Grivon, A
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)

by Chastang, C., Gautier, C., Brizoux, M., Grivon, A., Tissier, V., Amedeo, A., Costa, F.
Published in 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) (01.05.2011)

by Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., Lecavelier, A.
Published in Journal of microelectronics and electronic packaging (01.08.2015)

by Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., Lecavelier, A.
Published in Materials today : proceedings (2015)

by Dompierre, B., Aubin, V., Charkaluk, E., Maia Filho, W.C., Brizoux, M.
Published in Procedia engineering (01.04.2010)

by Gouno, E., Deleuze, G., Brizoux, M., Robert, C.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)

by Cadiou, S., Quendo, C., Schlaffer, E., Pessl, W., Le Fevre, A., Brizoux, M., Baudet, D.
Published in 2014 44th European Microwave Conference (01.10.2014)

by Lecavelier des Etangs-Levallois, Aurelien, Grivon, A., Baudet, D., Maia, W. C., Brizoux, M.
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)

by Filho, W. C. Maia, Grivon, A., Chesnay, J. G., Brizoux, M.
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)

by Filho, W. C. M., Hameau, S., Brizoux, M.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)

by Monier-Vinard, E, Bissuel, V, Daniel, O, Brizoux, M, Grivon, A, Pires, F, Maia, W
Published in 2010 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.10.2010)

by Maia Filho, W.C., Brizoux, M., Fremont, H., Danto, Y.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)

by Maia Filho, W.C., Brizoux, M., Dompierre, B., Guillaume, B.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)

by Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M., Brizoux, M.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)

by Dompierre, B., Aubin, V., Charkaluk, E., Maia Filho, W.C., Brizoux, M.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)