Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Ivankovic, Andrej, Vanstreels, Kris, Vanderstraeten, Daniel, Brizar, Guy, Gillon, Renaud, Blansaer, Eddy, Vandevelde, Bart
Published in Microelectronics and reliability (01.11.2012)
Published in Microelectronics and reliability (01.11.2012)
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Journal Article
Reliability of Power Devices with Copper Wire Bond
Pinili, Ton, Ramos, Manny, Manalo, Ginbert, Brizar, Guy, Matthijs, Koen, Colle, Frederik, DeGreve, Johan, Kocourek, Petr, Cowell, Bill, Jensen, John, McGlone, John, Hose, Sallie, Gambino, Jeff
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18.07.2022)
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18.07.2022)
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Conference Proceeding
Development of fast and easy methods for measuring the Young's modulus of molding compounds for IC packages
Ivankovic, A, Vanstreels, K, Vanderstraeten, D, Brizar, G, Gillon, R, Blansaer, E, Vandevelde, B
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding