Strength and reliability of low temperature transient liquid phase bonded Cu Sn Cu interconnects
Brincker, M., Söhl, S., Eisele, R., Popok, V.N.
Published in Microelectronics and reliability (01.09.2017)
Published in Microelectronics and reliability (01.09.2017)
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Journal Article
Strength and reliability of low temperature transient liquid phase bonded CuSnCu interconnects
Brincker, M., Söhl, S., Eisele, R., Popok, V.N.
Published in Microelectronics and reliability (01.09.2017)
Published in Microelectronics and reliability (01.09.2017)
Get full text
Journal Article
Effects of thermal cycling on aluminum metallization of power diodes
Brincker, M., Pedersen, K.B., Kristensen, P.K., Popok, V.N.
Published in Microelectronics and reliability (01.08.2015)
Published in Microelectronics and reliability (01.08.2015)
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Journal Article
Mechanisms of metallization degradation in high power diodes
Brincker, M., Kristensen, P.K., Pedersen, K.B., Popok, V.N.
Published in Microelectronics and reliability (01.09.2016)
Published in Microelectronics and reliability (01.09.2016)
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Journal Article