Mechanical analysis of wafer testing with FEM simulations
Brezmes, Angel Ochoa, Breitkopf, Cornelia
Published in Microelectronics and reliability (01.08.2016)
Published in Microelectronics and reliability (01.08.2016)
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Journal Article
Analytical and simulation-based risk assessment of imprint depth and brittle fracture in bond pad stacks
Reuther, Georg M., Penjovic, Ivan, Brezmes, Angel Ochoa, Pufall, Reinhard
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
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Conference Proceeding